DISPLAY DEVICE MANUFACTURING METHOD
According to one embodiment, a display device manufacturing method includes forming a lower electrode, forming an insulating layer on the lower electrode, forming a partition including a lower portion provided above the insulating layer and an upper portion having an end portion protruding relative to a side surface of the lower portion, providing a resist covering the partition on the insulating layer, forming a rib and a pixel aperture surrounded by the rib by removing a portion exposed from the resist of the insulating layer by etching, and forming an organic layer covering the lower electrode through the pixel aperture and emitting light in response to application of a voltage. The end portion of the upper portion is exposed from the resist in the etching.
1 . A display device manufacturing method, comprising:
forming a lower electrode;
forming an insulating layer on the lower electrode;
forming a partition including a lower portion provided above the insulating layer and an upper portion having an end portion protruding relative to a side surface of the lower portion;
providing a resist covering the partition on the insulating layer;
forming a rib and a pixel aperture surrounded by the rib by removing a portion exposed from the resist of the insulating layer by etching;
forming an organic layer covering the lower electrode through the pixel aperture and emitting light in response to application of a voltage; and
forming an upper electrode covering the organic layer, wherein
the end portion of the upper portion is exposed from the resist in the etching.
2 . The display device manufacturing method of claim 1 , wherein
the resist gradually decreases in width by the etching.
3 . The display device manufacturing method of claim 1 , wherein
at the end of the etching, the resist remains in an area surrounded by a lower surface of the upper portion, the side surface of the lower portion, and an upper surface of the rib.
4 . The display device manufacturing method of claim 3 , wherein
at the end of the etching, the end portion of the upper portion and an end portion of the resist remaining in the area are aligned with each other in plan view.
5 . The display device manufacturing method of claim 1 , wherein
at the end of the etching, the resist remains on the upper surface of the upper portion.
6 . The display device manufacturing method of claim 1 , wherein
the rib including a first portion having a constant thickness and a second portion decreasing in thicknesses toward the pixel aperture is formed by the etching.
7 . The display device manufacturing method of claim 6 , wherein
at the end of the etching, the end portion of the upper portion and a boundary between the first portion and the second portion are aligned with each other in plan view.
8 . The display device manufacturing method of claim 7 , wherein
the second portion has an inclined surface sloping from the boundary to the pixel aperture, and
an angle formed between the inclined surface and an upper surface of the lower electrode is less than or equal to 50 degrees.
9 . The display device manufacturing method of claim 1 , wherein
an end portion of the lower electrode overlaps with the partition in plan view.
10 . The display device manufacturing method of claim 1 , wherein
the upper portion includes a first top layer provided on the lower portion and a second top layer provided on the first top layer, and
the second top layer is formed of a conductive oxide.
11 . The display device manufacturing method of claim 10 , wherein
at the end of the etching, a lower surface of the first top layer is covered with the resist.
12 . The display device manufacturing method of claim 1 , wherein
the lower portion includes a stem layer and a bottom layer provided between the stem layer and the rib, and
an end portion of the bottom layer is located between the end portion of the upper portion and the side surface of the stem layer in plan view.
13 . The display device manufacturing method of claim 12 , wherein
an end portion of the lower electrode overlaps with the stem layer in plan view.
14 . The display device manufacturing method of claim 12 , wherein
at the end of the etching, the end portion of the bottom layer is covered with the resist.
15 . The display device manufacturing method of claim 12 , wherein
at the end of the etching, the side surface of the stem layer is covered with the resist.
16 . The display device manufacturing method of claim 1 , wherein
the etching is dry etching.
17 . The display device manufacturing method of claim 1 , wherein
the etching is anisotropic etching.