IP Library Patent Application 18963117
Patent Application
App. No. 18/963,117

Silicon Carbide Vapor Source Material for use in a Sublimation System for Growing Crystalline Silicon Carbide

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
18/963,117
Abstract

A silicon carbide source material structure for use in a sublimation system for growing single crystal silicon carbide is provided. The silicon carbide source material structure may comprise a first layer and a second layer, the first layer being different from the second layer in at least one property.

Claims (21)

1 . A silicon carbide source material structure for use in a sublimation system for growing single crystal silicon carbide, the silicon carbide source material structure comprising:

a first layer and a second layer, the first layer being different from the second layer in at least one property.

2 . The silicon carbide source material structure of claim 1 , wherein the property is silicon carbide polytype.

3 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 3C SiC and the second layer comprises 15R SiC.

4 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 3C SiC and the second layer comprises 4H SiC.

5 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 3C SiC and the second layer comprises 6H SiC.

6 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 3C SiC and the second layer comprises 21R SiC.

7 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 15R SiC and the second layer comprises 4H SiC.

8 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 15R SiC and the second layer comprises 6H SiC.

9 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 15R SiC and the second layer comprises 21R SiC.

10 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 4H SiC and the second layer comprises 6H SiC.

11 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 4H SiC and the second layer comprises 21R SiC.

12 . The silicon carbide source material structure of claim 2 , wherein the first layer comprises 6H SiC and the second layer comprises 21R SiC.

13 . The silicon carbide source material structure of claim 1 , wherein the property is material density of the silicon carbide.

14 . The silicon carbide source material structure of claim 13 , wherein the first layer comprises sintered or bound particles having a first average particle size and the second layer comprises sintered or bound particles having a second average particle size different from the first average particle size.

15 . The silicon carbide source material structure of claim 13 , wherein the first layer comprises a silicon carbide powder and the second layer comprises a solid structure.

16 . The silicon carbide source material structure of claim 13 , wherein a ratio of the material density of the second layer to the material density of the first layer is about 1.2 or more.

17 . The silicon carbide source material structure of claim 13 , wherein the first layer comprises graphite converted silicon carbide and the second layer comprises sintered or bound silicon carbide.

18 . The silicon carbide source material structure of claim 1 , wherein the property is the composition of the layer.

19 . The silicon carbide source material structure of claim 18 , wherein the first layer comprises silicon carbide and a dopant and the second layer does not contain a dopant.

20 . The silicon carbide source material structure of claim 19 , wherein the dopant comprises vanadium, aluminum, or boron.

Assignments (6)
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Mar 26, 2026
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 075280/0919 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0113 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0381 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0467 →
NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0588 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2025
From: TSVETKOV, VALERI FEDOROVICH; BRIXIUS, WILLIAM HENRY; GRIFFITHS, STEVEN HERBERT; HAIDET, BRIAN BENNETT; BALKAS, ELIF; KENT, CALEB ANDREW; KHLEBNIKOV, YURI I.
To: WOLFSPEED, INC.
Reel/Frame 072111/0614 →