Granted Patent B2

US 12,585,369 · App. 18/986,162 · Granted Mar 24, 2026

Inventors: Sanguk Kim (Suwon-si, KR); Shinyoung Kang (Suwon-si, KR); Joosung Kim (Suwon-si, KR); Hyoseok Na (Suwon-si, KR); Sungjae Moon (Suwon-si, KR); Wanjae Ju (Suwon-si, KR)

Assignee: SAMSUNG ELECTRONICS CO., LTD.

G06F3/0448G06F1/1698G06F3/04164H04M1/0202G06F2203/04104H04M2250/22

Abstract

Claims (53)

1 . An electronic device comprising:

a first antenna;

a second antenna;

a first radio frequency (RF) front-end circuit configured to transmit a first RF signal to the first antenna via a first RF signal path;

a second RF front-end circuit configured to transmit a second RF signal to the second antenna via a second RF signal path;

a transceiver connected to the first RF front-end circuit and the second RF front-end circuit; and

a multi-channel grip sensor comprising a first channel and a second channel, wherein the first channel is connected to the first antenna via a first grip sensing path, wherein the second channel is connected to the second antenna via a second grip sensing path, and wherein the multi-channel grip sensor is configured to sense a change in a first capacitance of the first antenna through the first channel and a change in a second capacitance of the second antenna through the second channel,

wherein the second grip sensing path comprises a portion of the first RF signal path.

2 . The electronic device of claim 1 , wherein the portion of the first RF signal path comprises a coaxial cable or a flexible RF cable (FRC).

3 . The electronic device of claim 2 , wherein the electronic device further comprises:

a communication processor configured to control the transceiver; and

a flexible printed circuit board (FPCB) connecting the multi-channel grip sensor to the communication processor.

4 . The electronic device of claim 3 , further comprising a main board and a sub-board,

wherein the first RF front-end circuit, the second RF front-end circuit, and the transceiver are provided on the main board of the electronic device, and

wherein the multi-channel grip sensor is provided on the sub-board of the electronic device.

5 . The electronic device of claim 4 , wherein the first antenna is provided adjacent to the sub-board, and

wherein the second antenna is provided adjacent to the main board.

6 . The electronic device of claim 5 , further comprising:

a first isolation circuit connected between the first channel of the multi-channel grip sensor and the first antenna on the first grip sensing path;

a second isolation circuit connected between the second channel and the first RF signal path on the second grip sensing path; and

a third isolation circuit connected between the first RF signal path and the second antenna on the second grip sensing path.

7 . The electronic device of claim 6 , wherein each of the first isolation circuit, the second isolation circuit, and the third isolation circuit comprises either an inductor of 40 nH or greater or a resistor of 500 ohms or less.

8 . The electronic device of claim 7 , further comprising:

a first matching circuit on the first RF signal path; and

a second matching circuit on the second RF signal path,

wherein the first matching circuit and the second matching circuit are configured to perform impedance matching.

9 . The electronic device of claim 8 , further comprising:

a third antenna; and

a third RF front-end circuit configured to transmit a third RF signal to the third antenna via a third RF signal path.

10 . The electronic device of claim 9 , wherein the third RF signal path comprises a coaxial cable or an FRC.

11 . The electronic device of claim 1 , further comprising:

a first board;

a second board connected to the first board via a flexible printed circuit board and a radio frequency cable; and

a processor provided on the first board,

wherein the first RF front-end circuit is provided on the first board,

wherein the first RF signal path comprises the radio frequency cable,

wherein the second RF front-end circuit is provided on the first board, and

wherein the multi-channel grip sensor is provided on the second board, and is connected to the processor via the flexible printed circuit board.

12 . The electronic device of claim 11 , further comprising a plurality of matching circuits,

wherein the processor is configured to, based on a change in capacitance of the first antenna or the second antenna, control the plurality of matching circuits to performance impedance matching.

13 . The electronic device of claim 11 , further comprising a first matching circuit provided on the second board,

wherein the processor is configured to, based on a change in capacitance of the first antenna, control the first matching circuit to performance impedance matching.

14 . The electronic device of claim 13 , further comprising a second matching circuit provided on the first board,

wherein the processor is configured to, based on a change in capacitance of the second antenna, control the second matching circuit to performance impedance matching.

15 . The electronic device of claim 14 , wherein the first RF front-end circuit comprises a first duplexer and a first amplifier, and

wherein the second RF front-end circuit comprises a second duplexer and a second amplifier.

16 . A method of sensing capacitance using a multi-channel grip sensor in an electronic device configured to perform wireless communication, the method comprising:

sensing, using a first channel of the multi-channel grip sensor connected to a first antenna of the electronic device, a change in a first capacitance of the first antenna;

sensing, using a second channel of the multi-channel grip sensor connected to a second antenna through a first radio frequency (RF) signal path, a change in a second capacitance of the second antenna; and

transmitting an RF signal is from a first RF front-end circuit of the electronic device to the first antenna through the first RF signal path.

17 . The method of claim 16 , further comprising:

performing impedance matching of the first antenna based on the change in the first capacitance of the first antenna; and

performing impedance matching of the second antenna based on the change in the second capacitance of the second antenna.

Assignments (1)

Priority Claims (2)

Continuity (2)

References Cited (25)