THERMAL COUPLING DEVICE FOR A COMMON MODE INDUCTOR
A thermal coupling device for a common mode inductor, configured to transfer heat to a heat sink. The device includes an annular prismatic ferrite core configured to be passed through by at least one electrical connector of an electronic component. A stand is secured to the heat sink, the ferrite core being in contact with the stand and the stand being configured to transfer the heat generated by the ferrite core to the heat sink. The thermal coupling device includes a clamping member configured to hold the ferrite core and the stand secured together, the ferrite core, the stand and the clamping member extending orthogonally with respect to the longitudinal reference plane of the electrical connector.
1 . Thermal coupling device for a common mode inductor, configured to transfer heat to a heat sink, the device comprising:
an annular prismatic ferrite core configured to be passed through by at least one electrical connector of the electronic component extending at least partially along a longitudinal reference plane, the ferrite core being configured to generate a magnetic field induced by an electric current flowing in the electrical connector of the electronic component;
a stand secured to the heat sink, the ferrite core being in contact with the stand, the stand being configured to transfer the heat generated by the ferrite core to the heat sink;
the thermal coupling device being characterized in that it comprises a clamping member configured to hold the ferrite core and the stand secured together, the ferrite core, the stand and the clamping member extending orthogonally with respect to the longitudinal reference plane of the electrical connector.
2 . Thermal coupling device according to claim 1 , wherein the stand and the clamping member have an annular prismatic structure and are coaxial with the ferrite core, the stand and the clamping member also being configured to be passed through by the electrical connector.
3 . Thermal coupling device according to claim 1 , wherein the stand comprises a substantially planar base extending parallel to the reference plane, said base of the stand being in surface contact with the heat sink.
4 . Thermal coupling device according to claim 3 , comprising a thermally conductive filler material, said material being interposed between the base and the heat sink.
5 . Thermal coupling device according to claim 3 , wherein the clamping member is formed by a leaf spring secured to the base of the stand.
6 . Thermal coupling device according to claim 1 , wherein the ferrite core is in one piece.
7 . Thermal coupling device according to claim 1 , wherein an annular groove is provided in the stand, the ferrite core being accommodated in the groove of the stand.
8 . Thermal coupling device according to claim 1 , comprising a thermally conductive filler material, said material being interposed between the stand and the ferrite core.
9 . Item of electrical equipment comprising:
at least one electronic component;
a heat sink;
at least one thermal coupling device according to claim 1 .
10 . Method for assembling an item of electrical equipment according to claim 9 , comprising:
fastening the stand of the thermal coupling device to the heat sink orthogonally with respect to a longitudinal reference plane;
putting the ferrite core of the thermal coupling device in position in contact with the stand;
holding the ferrite core in position in contact with the stand by way of the clamping member of the thermal coupling device;
passing the electrical connector of the electronic component through a through-hole in the ferrite core such that the electrical connector extends at least partially in the longitudinal reference plane.
11 . Thermal coupling device according to claim 2 , wherein the stand comprises a substantially planar base extending parallel to the reference plane, said base of the stand being in surface contact with the heat sink.
12 . Thermal coupling device according to claim 4 , wherein the clamping member is formed by a leaf spring secured to the base of the stand.
13 . Thermal coupling device according to claim 2 , wherein the ferrite core is in one piece.
14 . Thermal coupling device according to claim 2 , wherein an annular groove is provided in the stand, the ferrite core being accommodated in the groove of the stand.
15 . Thermal coupling device according to claim 2 , comprising a thermally conductive filler material, said material being interposed between the stand and the ferrite core.
16 . Item of electrical equipment comprising:
at least one electronic component;
a heat sink;
at least one thermal coupling device according to claim 2 .
17 . Thermal coupling device according to claim 3 , wherein the ferrite core is in one piece.
18 . Thermal coupling device according to claim 3 , wherein an annular groove is provided in the stand, the ferrite core being accommodated in the groove of the stand.
19 . Thermal coupling device according to claim 3 , comprising a thermally conductive filler material, said material being interposed between the stand and the ferrite core.
20 . Item of electrical equipment comprising:
at least one electronic component;
a heat sink;
at least one thermal coupling device according to claim 3 .