Image sensing module, camera module and electronic device
An image sensing module includes a circuit substrate, an optical flat element, a sensing element, metal protrusions and an anti-reflection layer. The circuit substrate has an upper surface, a lower surface opposite to the upper surface, an opening surface connected to the upper and lower surfaces, and an opening located at the opening surface. The optical flat element is fixed on the upper surface. The sensing element is disposed on the lower surface. The opening is located between the sensing element and the optical flat element. The sensing element and the optical flat element form an air gap therebetween. The opening surface surrounds the air gap. The metal protrusions are disposed between and electrically connected to the circuit substrate and the sensing element. The anti-reflection layer is disposed on a surface at the air gap and includes nano-ridge structures extending towards the air gap and irregularly arranged.
1 . An image sensing module comprising:
a circuit substrate having:
an upper surface;
a lower surface disposed opposite to the upper surface;
an opening surface connected to the upper surface and the lower surface; and
an opening located at the opening surface;
an optical flat element fixed on the upper surface of the circuit substrate, wherein the optical flat element is disposed corresponding to the opening of the circuit substrate;
a sensing element disposed on the lower surface of the circuit substrate, wherein the opening of the circuit substrate is located between the sensing element and the optical flat element, the sensing element and the optical flat element form an air gap therebetween, and the opening surface surrounds the air gap; and
a plurality of metal protrusions disposed between the circuit substrate and the sensing element, wherein each of the plurality of metal protrusions is electrically connected to the circuit substrate and the sensing element;
wherein the image sensing module further comprises at least one anti-reflection layer disposed on at least one surface at the air gap, the at least one anti-reflection layer comprises:
a plurality of nano-ridge structures extending along a direction from the at least one surface at the air gap towards the air gap, wherein the plurality of nano-ridge structures are irregularly arranged.
2 . The image sensing module according to claim 1 , wherein a height of each of the plurality of nano-ridge structures is H, and the following condition is satisfied:
25 nm≤ H≤ 400 nm.
3 . The image sensing module according to claim 2 , wherein the height of each of the plurality of nano-ridge structures is H, and the following condition is satisfied:
40 nm≤ H≤ 280 nm.
4 . The image sensing module according to claim 1 , wherein the at least one anti-reflection layer further comprises an interlayer disposed between the at least one surface at the air gap and the plurality of nano-ridge structures.
5 . The image sensing module according to claim 4 , wherein at least one area of the interlayer is exposed to the air gap.
6 . The image sensing module according to claim 1 , wherein the sensing element has:
a sensing surface disposed corresponding to the opening of the circuit substrate, wherein the sensing surface is configured to convert an optical image signal into an electrical signal; and
a periphery surface disposed surrounding the sensing surface;
wherein the at least one anti-reflection layer is disposed on at least one of the sensing surface and the periphery surface of the sensing element.
7 . The image sensing module according to claim 6 , wherein the plurality of metal protrusions are disposed on the periphery surface and arranged on at least one side of the periphery surface.
8 . The image sensing module according to claim 1 , wherein the at least one anti-reflection layer is disposed on at least one of the upper surface, the lower surface and the opening surface of the circuit substrate.
9 . The image sensing module according to claim 1 , wherein the optical flat element has an inner surface disposed facing towards the air gap, and the at least one anti-reflection layer is disposed on the inner surface of the optical flat element.
10 . The image sensing module according to claim 1 , further comprising a filling element disposed between the circuit substrate and the sensing element, wherein the filling element wholly covers each of the plurality of metal protrusions, and the filling element surrounds and seals the air gap.
11 . The image sensing module according to claim 10 , wherein the filling element has at least one curved surface on which the at least one anti-reflection layer is disposed.
12 . The image sensing module according to claim 10 , wherein at least part of the filling element is disposed on the opening surface of the circuit substrate.
13 . The image sensing module according to claim 10 , wherein the filling element is made of an opaque material.
14 . The image sensing module according to claim 1 , wherein the circuit substrate further has a plurality of anti-flare structures disposed on the opening surface of the circuit substrate, and the plurality of anti-flare structures taper off towards the air gap from the opening surface.
15 . The image sensing module according to claim 1 , wherein a distance between the lower surface of the circuit substrate and the optical flat element is D1, a thickness of the air gap is D2, and the following condition is satisfied:
0.25≤ D 1/ D 2≤0.98.
16 . The image sensing module according to claim 15 , wherein the distance between the lower surface of the circuit substrate and the optical flat element is D1, the thickness of the air gap is D2, and the following condition is satisfied:
0.3≤ D 1/ D 2≤0.95.
17 . A camera module comprising:
a lens module; and
the image sensing module of claim 1 disposed on an image side of the lens module.
18 . An electronic device comprising:
the camera module of claim 17 .