IP Library Patent Application 19009387
Patent Application Utility
App. No. 19/009,387 · Confirmation No. 1106

Die Labelling for Semiconductor Die

Applicant: Wolfspeed, Inc.
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Code Description Pages PDF
2026-07-10 NTC.PUB Notice of Publication 1 View
2025-03-06 PET.SEMI.D Semiconductor Petition Dismissed/Denied 2 View
2025-01-24 PEFR Applicant Response to Pre-Exam Formalities Notice View
2025-01-24 TRAN.LET Transmittal Letter 2 View
2025-01-24 OATH Oath or Declaration filed 2 View
2025-01-24 N417 Electronic Filing System Acknowledgment Receipt 2 View
2025-01-24 APP.FILE.REC Filing Receipt 3 View
2025-01-24 WFEE Fee Worksheet (SB06) 1 View
2025-01-24 M327 Miscellaneous Communication to Applicant - No Action Count 1 View
2025-01-24 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2025-01-03 APP.TEXT Application body structured text document View
2025-01-03 PA.. Power of Attorney View
2025-01-03 N417.PYMT Electronic Fee Payment 2 View
2025-01-03 SPEC Specification 29 View
2025-01-03 CLM Claims 3 View
2025-01-03 ABST Abstract 1 View
2025-01-03 PET.SEMI Petition for Semiconductor Pilot 3 View
2025-01-03 136A Authorization for Extension of Time all replies 1 View
2025-01-03 PA.. Power of Attorney 2 View
2025-01-03 TRAN.LET Transmittal Letter 1 View
2025-01-03 DRW Drawings-only black and white line drawings 11 View
2025-01-03 ADS Application Data Sheet 9 View
2025-01-03 N417 Electronic Filing System Acknowledgment Receipt 3 View
2025-01-03 DRW.SUPP Drawings-black and white line and/or other drawings View
2025-01-03 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
19/009,387
Filed
2025-01-03
Pub. No.
US20260198331A1
Art Unit
OPAP