PLASMONIC FIELD-ENHANCED PHOTODETECTOR AND IMAGE SENSOR

1 . A photodetector comprising:

a metal layer that shields incident light and generates surface plasmon polaritons (SPPs);

a dielectric material formed at nanoholes in which at least a part of the metal surface is opened,

wherein photons of the incident light interact with surface plasmons (SPs) generated at an interface with the metal layer and the dielectric material to generate SPPs, and

wherein a wavelength of the light is compressed to increase energy when the SPs is converted to the SPPs.

2 . The photodetector of the claim 1 , wherein the photons having a wavelength equal to or longer than 1200 nm is converted to the SPPs having a wavelength of 200 nm.

3 . The photodetector of the claim 1 , wherein the SPPs form localized surface plasmons (LSPs) at edges where the metal layer meets the dielectric material to enhance localized electric field.

4 . The photodetector of the claim 3 , further comprising an insulator interposed between a light absorbing layer and semiconductor layers.

5 . The photodetector of the claim 4 , wherein the insulator is configured to absorbs the generated SPPs and allows the localized electric field to tunnel via the insulator.

6 . The photodetector of the claim 4 , wherein threshold voltage of a current channel formed at the interface is changed as the localized electric field is tunneled via the insulator.

7 . The photodetector according to claim 3 , wherein density of the localized electric field is configured to increase per unit area to increase photocurrent as the size of the nanoholes decreases.

8 . The photodetector of claim 1 , wherein the SPPs are increased in momentum and energy based on a wave vector changed by the incident light and react with excitons of a semiconductor layer.

9 . The photodetector according to claim 4 , wherein photocurrent is generated at the semiconductor layer by absorbing the SPPs at the insulator.

10 . The photodetector according to claim 1 , wherein the nanoholes is formed of a material having a greater dielectric constant than air, and

wherein the metal layer is configured to shields incident light propagating in air.

11 . An image sensor comprising:

a metal surface;

a metal nanohole array formed on the metal surface; and

a detector array formed at a position corresponding to the metal nanohole array,

wherein the metal surface is configured to shield incident light and to generate surface plasmon polaritons (SPPs),

wherein the detector array comprises a dielectric formed at nanoholes in which at least a part of the metal surface is opened, and

wherein photons of the incident light interact with surface plasmons (SPs) generated at an interface with the metal surface and the dielectric to generate SPPs.

12 . The image sensor of claim 11 , wherein a wavelength of the light is compressed to increase energy when the SPs is converted to the SPPs.

13 . The image sensor of claim 11 , wherein the photons having a wavelength equal to or longer than 1200 nm is converted to the SPPs having a wavelength of 200 nm.

14 . The image sensor of the claim 11 , wherein the SPPs form localized surface plasmons (LSPs) at edges where the metal layer meets the dielectric material to enhance localized electric field.

15 . The image sensor of the claim 14 , further comprising an insulator interposed between a light absorbing layer and semiconductor layers,

wherein the insulator is configured to absorb the generated SPPs and allows the localized electric field to tunnel via the insulator.

16 . The image sensor of the claim 14 , wherein threshold voltage of a current channel formed at the interface is changed as the localized electric field is tunneled via the insulator.

17 . A method of operating a photodetector, the method comprising:

generating, at a metal layer that shields incident light, surface plasmon polaritons (SPPs), the SPPs being generated by combining surface plasmons (SPs) with photons of a light wave; and

generating photocurrent, at a semiconductor layer, by using the absorbed SPPs,

wherein photons of the shielded incident light interact with surface plasmons (SPs) generated at an interface with the metal layer and a dielectric material formed at nanoholes in which at least a part of the metal layer is opened.

18 . The method of claim 17 , wherein a wavelength of the light is compressed to increase energy when the SPs is converted to the SPPs.

19 . The method of claim 17 , wherein the photons having a wavelength equal to or longer than 1200 nm is converted to the SPPs having a wavelength of 200 nm.

20 . The method of the claim 17 , further comprising absorbing, at an insulator layer interposed between a light absorbing layer and the semiconductor layer, the generated SPPs,

wherein the SPPs form localized surface plasmons (LSPs) at edges where the metal layer meets the dielectric material to enhance localized electric field, and

wherein the insulator is configured to absorb the generated SPPs and allows the localized electric field to tunnel via the insulator.