SEMICONDUCTOR DEVICE
A semiconductor device including a first oxide semiconductor layer, a first gate electrode opposing the first oxide semiconductor layer, a first gate insulating layer between the first oxide semiconductor layer and the first gate electrode, a first insulating layer covering the first oxide semiconductor layer and having a first opening, a first conductive layer above the first insulating layer and in the first opening, the first conductive layer being electrically connected to the first oxide semiconductor layer, and an oxide layer between an upper surface of the first insulating layer and the first conductive layer, wherein the first insulating layer is exposed from the oxide layer in a region not overlapping the first conductive layer in a plan view.
1 . A semiconductor device comprising:
a substrate;
a gate electrode on the substrate;
a gate insulating layer on the gate electrode;
an oxide semiconductor layer on the gate insulating layer and overlapping the gate electrode;
a first electrode arranged on the oxide semiconductor layer and electrically connecting with the oxide semiconductor layer;
a first insulating layer covering the oxide semiconductor layer;
a first conductive layer on the first insulating layer; and
an oxide layer between the first electrode and the first conductive layer,
wherein
the first insulating layer directly contacts the oxide semiconductor layer and the oxide layer,
the oxide layer is not overlapped the oxide semiconductor layer and the gate electrode, and
the first insulating layer is exposed from the oxide layer in a region not overlapping the first conductive layer in a plan view.
2 . The semiconductor device according to claim 1 ,
further comprising a first opening in the first insulating layer and a second opening in the oxide layer, wherein
the second opening is arranged overlapping the first opening in a plan view, and
the first conductive layer is arranged in the first opening and the second opening and directly contacts the first electrode at a bottom part of the first opening.
3 . The semiconductor device according to claim 1 , wherein
the first insulating layer is an oxide insulating layer,
the oxide layer is an oxide insulating layer with the same composition as the first insulating layer, and
a composition ratio of oxygen in the oxide layer is larger than a composition ratio of oxygen in the first insulating layer.
4 . The semiconductor device according to claim 1 , wherein
the gate electrode is arranged below the oxide semiconductor layer.
5 . The semiconductor device according to claim 1 , wherein
the first conductive layer directly contacts the oxide layer at a side wall of the second opening.
6 . The semiconductor device according to claim 1 , wherein
a pattern of the oxide layer is substantially a same pattern as a pattern of the first conductive layer in a plan view.