IP Library Patent Application 19111521
Patent Application
App. No. 19/111,521

SLOT-COUPLING TYPE COUPLER

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Quick Facts
Patent No.
US None
App. No.
19/111,521
Abstract

An embodiment is a slot-coupling type coupler for connecting a high-frequency circuit to a waveguide tube. The coupler includes a substrate, at least a part of the substrate being inserted into the waveguide tube, and a conductor patch on the substrate and configured to emit a high-frequency wave generated by the high-frequency circuit into the waveguide tube. The conductor patch comprises a first conductor patch on a first side of the substrate and includes a complementary metamaterial cell including one or more conductor portions forming one or more gaps.

Claims (63)

1 .- 7 . (canceled)

8 . A slot-coupling type coupler for connecting a high-frequency circuit to a waveguide tube, comprising:

a substrate, at least a part of the substrate being inserted into the waveguide tube; and

a conductor patch on the substrate and configured to emit a high-frequency wave generated by the high-frequency circuit into the waveguide tube, the conductor patch comprising a first conductor patch on a first side of the substrate and includes a complementary metamaterial cell including one or more conductor portions and one or more gaps.

9 . The slot-coupling type coupler according to claim 8 , further comprising:

a coplanar waveguide tube including a portion of the substrate in front of the conductor patch, the coplanar waveguide tube being configured to transmit the high-frequency wave.

10 . The slot-coupling type coupler according to claim 8 , wherein

the conductor patch is configured to change a mode of the high-frequency wave.

11 . The slot-coupling type coupler according to claim 8 ,

wherein the high-frequency circuit is on the substrate.

12 . The slot-coupling type coupler according to claim 8 , wherein

the complementary metamaterial cell has a shape configured to resonate with the high-frequency wave.

13 . The slot-coupling type coupler according to claim 8 , wherein

the high-frequency circuit is a differential output circuit including a first output terminal and a second output terminal;

the first conductor patch is connected to the first output terminal; and

the conductor patch further comprises a second conductor patch on the first side of the substrate, the second conductor patch having a shape symmetrical to the first conductor patch, and connected to the second output terminal.

14 . The slot-coupling type coupler according to claim 8 , wherein

the conductor patch further comprises a second conductor patch on a second side of the substrate opposite the first side;

the second conductor patch is opposite the first conductor patch via the substrate and does not include a complementary metamaterial cell; and

the first conductor patch is grounded.

15 . A slot-coupling type coupler for connecting a high-frequency circuit to a waveguide tube, comprising:

a conductor patch on a first side of a substrate, the conductor patch comprising:

a plurality of complementary metamaterial cells arranged in a periodic array,

wherein each complementary metamaterial cell includes:

one or more conductor portions, and

one or more gaps between the one or more conductor portions;

wherein the complementary metamaterial cells are configured to resonate with a high-frequency wave generated by the high-frequency circuit; and

wherein the conductor patch is configured to emit the high-frequency wave into the waveguide tube.

16 . The slot-coupling type coupler of claim 15 , wherein the complementary metamaterial cells are configured to adjust an impedance of the conductor patch to improve transition efficiency between a quasi-TEM mode and a TE10 mode.

17 . The slot-coupling type coupler of claim 15 , further comprising:

a coplanar waveguide on the first side of the substrate, the coplanar waveguide connected to the conductor patch and configured to transmit the high-frequency wave to the conductor patch.

18 . The slot-coupling type coupler of claim 15 , further comprising:

a second conductor patch on a second side of the substrate opposite the first side, wherein the second conductor patch does not include complementary metamaterial cells.

19 . The slot-coupling type coupler of claim 18 , wherein:

the conductor patch on the first side of the substrate is configured to be grounded; and

the second conductor patch has an outline matching the conductor patch on the first side of the substrate.

20 . The slot-coupling type coupler of claim 15 , wherein:

the slot-coupling type coupler is configured to connect to a high-frequency circuit, the high-frequency circuit being a differential output circuit including a first output terminal and a second output terminal;

the conductor patch is a first conductor patch configured to be connected to the first output terminal; and

the slot-coupling type coupler further comprises a second conductor patch on the first side of the substrate, the second conductor patch having a shape symmetrical to the first conductor patch and configured to be connected to the second output terminal.

21 . A method of manufacturing a slot-coupling type coupler, comprising:

forming a first conductor layer on a first side of a substrate;

patterning the first conductor layer to form a conductor patch, wherein patterning the first conductor layer comprises:

creating a plurality of complementary metamaterial cells arranged in a periodic array within the conductor patch, each complementary metamaterial cell including:

a plurality of conductor portions, and

one or more gaps between the conductor portions;

wherein the complementary metamaterial cells are configured to resonate with a high-frequency wave; and

configuring the conductor patch to emit the high-frequency wave into a waveguide tube.

22 . The method of claim 21 , wherein creating the plurality of complementary metamaterial cells comprises:

etching the first conductor layer using a photolithography mask with a pattern corresponding to the complementary metamaterial cells to form the conductor portions and the gaps.

23 . The method of claim 21 , further comprising:

forming a coplanar waveguide on the first side of the substrate, the coplanar waveguide connected to the conductor patch and configured to transmit the high-frequency wave to the conductor patch.

24 . The method of claim 21 , further comprising:

forming a second conductor layer on a second side of the substrate opposite the first side; and

patterning the second conductor layer to form a ground plane.

25 . The method of claim 21 , wherein patterning the first conductor layer further comprises:

forming a signal line connected to the conductor patch; and

forming ground planes adjacent to the signal line to create a coplanar waveguide.

26 . The method of claim 21 , further comprising:

selecting geometric parameters for the complementary metamaterial cells based on a desired operating frequency range of the slot-coupling type coupler, wherein the geometric parameters comprise a period of the complementary metamaterial cells, a size of an outer gap ring, a size of an inner gap ring, a distance between the inner and outer gap rings, a width of the outer gap ring, or a width of the inner gap ring.

27 . The method of claim 21 , further comprising:

forming a second conductor patch on the first side of the substrate, the second conductor patch having a shape symmetrical to the conductor patch;

wherein the conductor patch is configured to connect to a first output terminal of a differential output high-frequency circuit, and the second conductor patch is configured to connect to a second output terminal of the differential output high-frequency circuit.

Assignments (2)
CHANGE OF NAME Recorded Aug 27, 2025
From: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
To: NTT, INC.
Reel/Frame 072649/0291 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2025
From: PANDER, ADAM; KITAYAMA, DAISUKE
To: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Reel/Frame 070503/0622 →