Immersion liquid-cooling system and control method therefor, and server
View Patent ↗The present application relates to an immersion liquid-cooling system and a control method therefor, and a server. The immersion liquid-cooling system includes a liquid-cooling chassis filled with a liquid-state cooling working medium and a mainboard fixed in the liquid-cooling chassis in a vertical direction; the mainboard is provided with at least one high-power component and at least one low-power component; the liquid-cooling chassis includes a chassis body, main fluid deflectors, secondary fluid deflectors, and flow adjustment plates; the main fluid deflectors extend in the vertical direction to form a main flow channel, and the main flow channel contains all high-power components; the secondary fluid deflectors are arranged opposite to the main fluid deflectors to form secondary flow channels, and the secondary flow channels contain the low-power components; and the secondary flow channels are connected to the main flow channel by means of the flow adjustment plates.
1. An immersion liquid-cooling system, comprising a liquid-cooling chassis and a mainboard;
wherein the mainboard is fixed in the liquid-cooling chassis in a vertical direction, and the liquid-cooling chassis is filled with a liquid-state cooling working medium, whereby the mainboard is immersed in the liquid-state cooling working medium;
the mainboard is provided with at least one high-power component and at least one low-power component; the heat dissipation capacity of the high-power components per unit time is greater than the heat dissipation capacity of the low-power components per unit time;
the liquid-cooling chassis comprises a chassis body, main fluid deflectors, secondary fluid deflectors, and flow adjustment plates; the main fluid deflectors extend in the vertical direction to form a main flow channel, and the main flow channel contains all of the high-power components; the secondary fluid deflectors are arranged opposite to the main fluid deflectors to form secondary flow channels, and the secondary flow channels contain the low-power components; and the secondary flow channels are connected to the main flow channel by means of the flow adjustment plates;
wherein the secondary flow channels are adjacent to the main flow channel, and the secondary flow channels are located on both sides of the main flow channel;
wherein one end of each of the secondary flow channels connected to the main flow channel is a secondary flow channel outlet, and the flow adjustment plate is provided on the secondary flow channel outlet;
the other end of the secondary flow channel away from the main flow channel forms a secondary flow channel inlet; and
the liquid-state cooling working medium can flow through the flow adjustment plates via the secondary flow channels into the main flow channel.
2. The immersion liquid-cooling system according to claim 1 , wherein the chassis body is provided with a working medium inlet at a top portion thereof and a working medium outlet at a bottom portion thereof; and the main flow channel is provided with a main flow channel inlet at a top end thereof and a main flow channel outlet at a bottom end thereof, wherein the main flow channel inlet is arranged adjacent to the working medium inlet, and the main flow channel outlet is communicated with the working medium outlet.
3. The immersion liquid-cooling system according to claim 2 , wherein the immersion liquid-cooling system further comprises a working medium inlet pipe and a working medium outlet pipe; and the working medium inlet pipe is connected to the working medium inlet, and the working medium outlet pipe is connected to the working medium outlet.
4. The immersion liquid-cooling system according to claim 3 , wherein the working medium inlet pipe extends from the top portion of the chassis body to the bottom portion of the chassis body in the chassis body, and then extends from the bottom portion of the chassis body to above the main flow channel inlet; and the liquid-state cooling working medium in the working medium inlet pipe exchanges heat with the liquid-state cooling working medium in the chassis body.
5. The immersion liquid-cooling system according to claim 3 , wherein the working medium inlet pipe is in the form of a spiral tube in the chassis body.
6. The immersion liquid-cooling system according to claim 3 , wherein in the chassis body, the liquid-state cooling working medium between the working medium inlet pipe and the main flow channel or the secondary flow channels dissipates heat in a self-circulation manner.
7. The immersion liquid-cooling system according to claim 3 , further comprising a circulating pump and a heat exchanger, wherein the circulating pump is installed on the working medium outlet pipe, and the heat exchanger is connected between the working medium outlet pipe and the working medium inlet pipe.
8. The immersion liquid-cooling system according to claim 7 , wherein the circulating pump is configured to:
increase a circulation rate of the liquid-state cooling working medium in the main flow channel when an operating temperature of the high-power components in the main flow channel is higher than a maximum operating temperature of the low-power components in all secondary flow channels; and
decrease the circulation rate of the liquid-state cooling working medium in the main flow channel when the operating temperature of the high-power components in the main flow channel is lower than the maximum operating temperature of the low-power components in all secondary flow channels.
9. The immersion liquid-cooling system according to claim 1 , wherein a depth of the liquid-state cooling working medium in the chassis body is greater than a length of the mainboard along the vertical direction, so that the mainboard, the main flow channel and the secondary flow channels are completely immersed in the liquid-state cooling working medium.
10. The immersion liquid-cooling system according to claim 1 , wherein the secondary fluid deflectors are installed on the main fluid deflectors to form the secondary flow channels.
11. The immersion liquid-cooling system according to claim 1 , wherein each of the flow adjustment plates comprises shutter blades and a motor, wherein the motor is configured to control the rotation of the shutter blades.
12. The immersion liquid-cooling system according to claim 1 , wherein each of the flow adjustment plates comprises an adjustable valve.
13. The immersion liquid-cooling system according to claim 1 , wherein each of the main fluid deflectors is provided with spoilers at a position corresponding to the high-power component.
14. The immersion liquid-cooling system according to claim 13 , wherein the spoiler is in the form of a baffle plate or wave-shaped.
15. The immersion liquid-cooling system according to claim 1 , wherein in the main flow channel, a spoiler matrix structure is provided upstream of the high-power component, and the spoiler matrix structure comprises a plurality of spoiler columns arranged in an array.
16. The immersion liquid-cooling system according to claim 15 , wherein the spoiler matrix structures are provided on the main fluid deflectors.
17. The immersion liquid-cooling system according to claim 15 , wherein a cross-sectional shape of each of spoiler columns is circular, triangular or waterdrop-shaped.
18. The immersion liquid-cooling system according to claim 1 , wherein the high-power components comprise a chip.
19. The immersion liquid-cooling system according to claim 1 , wherein the flow adjustment plates are configured to:
reduce a flow of the liquid-state cooling working medium flowing into the main flow channel from the secondary flow channels when an operating temperature of the high-power components in the main flow channel is higher than a maximum operating temperature of the low-power components in all secondary flow channels; and
increase the flow of the liquid-state cooling working medium flowing into the main flow channel from the secondary flow channels when the operating temperature of the high-power components in the main flow channel is lower than the maximum operating temperature of the low-power components in all secondary flow channels.
20. A server, comprising an immersion liquid-cooling system comprising a liquid-cooling chassis and a mainboard;
wherein the mainboard is fixed in the liquid-cooling chassis in a vertical direction, and the liquid-cooling chassis is filled with a liquid-state cooling working medium, whereby the mainboard is immersed in the liquid-state cooling working medium;
the mainboard is provided with at least one high-power component and at least one low-power component; the heat dissipation capacity of the high-power components per unit time is greater than the heat dissipation capacity of the low-power components per unit time;
the liquid-cooling chassis comprises a chassis body, main fluid deflectors, secondary fluid deflectors, and flow adjustment plates; the main fluid deflectors extend in the vertical direction to form a main flow channel, and the main flow channel contains all of the high-power components; the secondary fluid deflectors are arranged opposite to the main fluid deflectors to form secondary flow channels, and the secondary flow channels contain the low-power components; and the secondary flow channels are connected to the main flow channel by means of the flow adjustment plates;
wherein the secondary flow channels are adjacent to the main flow channel, and the secondary flow channels are located on both sides of the main flow channel;
wherein one end of each of the secondary flow channels connected to the main flow channel is a secondary flow channel outlet, and the flow adjustment plate is provided on the secondary flow channel outlet;
the other end of the secondary flow channel away from the main flow channel forms a secondary flow channel inlet; and
the liquid-state cooling working medium can flow through the flow adjustment plates via the secondary flow channels into the main flow channel.