WIRELESS HANDHELD DEVICES, RADIATION SYSTEMS AND MANUFACTURING METHODS
A stand-alone component for a radiating system of a wireless device comprises a dielectric support and first and second surfaces respectively comprising first and a second conductive surface elements spaced by the dielectric support and electrically connected by a conductor. The stand-alone component features a parallelepiped shape, and the first and second surfaces are polygons. The first and second surfaces are the largest surfaces of the parallelepiped component. The stand-alone component has a maximum size smaller than a longest operating wavelength of the stand-alone component divided by 20 and is connected to a radiofrequency system and coupled to a ground plane within the radiating system.
1 - 20 . (canceled)
21 . A wireless stand-alone component for a radiating system configured to couple electromagnetic energy within a frequency band to and/or from a ground plane within a wireless device, the component comprising:
a rectangular-shaped dielectric support having a maximum side length less than 1/20 th of a longest free-space wavelength L in the frequency band;
a first conductive element on a first surface of the dielectric support; and
an input/output port to convey wireless signals to the first conductive element, wherein:
the component entirely fits inside a limiting volume of L 3 /8000,
the component is configured to be mounted on a clearance of the ground plane,
the component and the ground plane are external to an integrated circuit package, and
the component has a characteristic resonant frequency above the frequency band of the wireless device.
22 . The component of claim 21 , wherein the component fits inside a limiting volume of L 3 /30000.
23 . The component of claim 21 , wherein the maximum side length of the dielectric support is less than L/30 th .
24 . The component of claim 21 , further comprising a second conductive element on a surface of the dielectric support.
25 . The component of claim 24 , wherein the second conductive element is not connected through contact to the first conductive element.
26 . The component of claim 24 , wherein the second conductive element is on the first surface of the dielectric support.
27 . The component of claim 24 , wherein the second conductive element is on a second surface of the dielectric support, the first and second conductive elements being connected by a linear conductive element.
28 . The component of claim 27 , wherein the linear conductive element includes a via hole.
29 . The component of claim 28 , wherein the via hole is one a plurality of via holes connecting the first and second conductive elements.
30 . The component of claim 21 , wherein the first conductive element has a concave geometry.
31 . The component of claim 21 , wherein a ratio between the characteristic resonant frequency of the component and a lowest frequency of the frequency band greater than 3.
32 . The component of claim 21 , wherein the dielectric support comprises a ceramic material.
33 . The component of claim 21 , wherein the clearance defines a gap on the ground plane and the component is electrically connected at a first end to an edge of the gap.
34 . The component of claim 33 , wherein the clearance defines a gap on the ground plane and the component is electrically connected at a second end to a feeding point.
35 . The component of claim 21 , wherein the frequency band includes a 2.4 GHz frequency.
36 . A wireless device, comprising:
the wireless stand-alone component of claim 21 ;
a processing module; and
a power management module,
wherein the wireless device is configured to operate according to a Bluetooth, WiFi or ZigBee communication standard.
37 . A wireless device configured to operate according to a Bluetooth, WiFi or ZigBee communication standard, the wireless device comprising:
a processing module;
a power management module;
a wireless communication module; and
a radiating system, comprising:
a printed circuit board including a ground plane conductive layer supporting one or more radiating electromagnetic modes for transmitting and receiving signals within a frequency band including a 2.4 GHz frequency;
a clearance defining a gap on the ground plane conductive layer; and
a wireless stand-alone component mounted on the clearance of the ground plane conductive layer and configured to couple electromagnetic energy to and/or from the ground plane conductive layer within the frequency band, the wireless stand-alone component comprising:
a rectangular-shaped dielectric support comprising a ceramic material and having a maximum side length less than 1/20 th of a longest free-space wavelength L in the frequency band;
a first conductive element on a first surface of the dielectric support;
a second conductive element on a surface of the dielectric support, the first and second conductive elements not being connected through contact; and
an input/output port to convey wireless signals to the first conductive element, wherein the wireless stand-alone component entirely fits inside a limiting volume of L 3 /8000, has a characteristic resonant frequency above the frequency band, and is electrically connected at a first end to an edge of the gap and connected at a second end to the wireless communication module,
wherein the ground plane conductive layer and the wireless stand-alone component are external to an integrated circuit package.