IP Library › Patent Application 19204082
Patent Application Utility
App. No. 19/204,082 · Confirmation No. 5665

GROUND COVER STRUCTURE FOR A CHIP-TO-CHIP INTERCONNECTION

Inventor: Ka Kit WONG
Docketed New Case - Ready for Examination View Publication ↗
⬇ PDF
 Code Description Pages PDF
2026-04-09 NTC.PUB Notice of Publication 1 View
2026-02-05 NTC.PUB.DATE Notice of New or Revised Publication Date 1 View
2026-01-09 NTC.PUB.DATE Notice of New or Revised Publication Date 1 View
2025-05-16 WFEE Fee Worksheet (SB06) 1 View
2025-05-16 APP.FILE.REC Filing Receipt 3 View
2025-05-16 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2025-05-09 APP.TEXT Application body structured text document — View
2025-05-09 N417 Electronic Filing System Acknowledgment Receipt 3 View
2025-05-09 ADS Application Data Sheet 8 View
2025-05-09 SPEC Specification 20 View
2025-05-09 CLM Claims 5 View
2025-05-09 ABST Abstract 1 View
2025-05-09 DRW Drawings-only black and white line drawings 6 View
2025-05-09 OATH Oath or Declaration filed 2 View
2025-05-09 PA.. Power of Attorney 2 View
2025-05-09 N417.PYMT Electronic Fee Payment 2 View
2025-05-09 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2025-05-09 DRW.SUPP Drawings-black and white line and/or other drawings — View
2025-05-09 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2025-05-09 OATH Oath or Declaration filed 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
19/204,082
Filed
2025-05-09
Pub. No.
US20260101820A1
Art Unit
OPAP