IP Library Patent Application 63688622
Patent Application Provisional
App. No. 63/688,622 · Confirmation No. 8683

GROUND COVERED ARCHITECTURE WIRE-BONDING JOINT IN SEMICONDUCTORS

Inventor: Ka Kit WONG
Provisional Application Expired
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2025-05-09 OATH Oath or Declaration filed 3 View
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2024-08-29 APPENDIX Appendix to the specification 1 View
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Quick Facts
App. No.
63/688,622
Filed
2024-08-29