THREE-DIMENSIONAL HEAT TRANSFER DEVICE

1 . A three-dimensional heat transfer device, comprising:

a vapor chamber including a bottom plate and a cover, the bottom plate comprising a main portion, a recessed portion, and a plurality of first supports, the recessed portion is recessed from the main portion, the plurality of first supports is coupled to the recessed portion and protrudes therefrom, the cover is disposed on the bottom plate and the plurality of first supports, the bottom plate and the cover together surround a fluid chamber, the cover has a plurality of through holes; and

a plurality of flattened heat pipes, respectively disposed on the main portion and the recessed portion through the plurality of through holes and arranged along an extension direction of a short side of the vapor chamber,

wherein major axes of cross-sections of the plurality of flatten heat pipes are parallel to a long side of the vapor chamber.

2 . The three-dimensional heat transfer device according to claim 1 , further comprises a plurality of thermal conductive structures that are coupled to the recessed portion and protrudes therefrom, the plurality of thermal conductive structures have a rectangular shape, and the plurality of thermal conductive structures are parallel to a long side of the vapor chamber.

3 . The three-dimensional heat transfer device according to claim 2 , wherein at least two first supports are coupled to each thermal conductive structure.

4 . The three-dimensional heat transfer device according to claim 1 , wherein in the extension direction of the short side of the vapor chamber, a distance between two adjacent flatten heat pipes is larger than a thickness of each of the plurality of flatten heat pipes.

5 . The three-dimensional heat transfer device according to claim 1 , further comprising a first capillary structure, wherein the first capillary structure is located in the fluid chamber and stacked on the bottom plate, the plurality of flattened heat pipes are in thermal contact with the first capillary structure, and the plurality of flatten heat pipes are connected to the bottom plate via the first capillary structure.

6 . The three-dimensional heat transfer device according to claim 5 , further comprising a second capillary structure, wherein the second capillary structure is located in the fluid chamber and stacked on the cover.

7 . The three-dimensional heat transfer device according to claim 1 , wherein each of the plurality of flattened heat pipes has an opening end and a recessed portion located at the opening end, and the recessed portion is configured to enable a flow of working fluid inside of the fluid chamber to transport into and out of an inner space of each plurality of flatten heat pipes via the opening end, whereby the flow is perpendicular to the long side of the vapor chamber.

8 . The three-dimensional heat transfer device according to claim 7 , wherein the recessed portion is located between two short walls of the flatten heat pipe so that the opening end has a U-shape.

9 . The three-dimensional heat transfer device according to claim 8 , wherein the two short walls that define the U-shaped opening end have different lengths.

10 . The three-dimensional heat transfer device according to claim 7 , wherein the recessed portion removes a portion of a short wall of the flatten heat pipe so that the opening end has an L-shape.

11 . The three-dimensional heat transfer device according to claim 1 , wherein the bottom plate further comprises a plurality of second supports, the plurality of second supports protrude from the main portion, and a diameter of each of the plurality of second supports is larger than a diameter of each of the plurality of first supports.

12 . The three-dimensional heat transfer device according to claim 1 , further comprising a heat dissipation fin, wherein the heat dissipation fin is mounted on the plurality of flatten heat pipes.