Patent Application
Utility
App. No. 19/251,058
· Confirmation No. 2666
Scalable Thermal Diode Implementation in Monolithic and Multi-Die FPGAs
Prosecution Suspended/Delayed
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2025-11-07 | AISP |
Letter of Suspension - Applicant Initiated | 2 | View | |
| 2025-10-17 | NTC.PUB |
Notice of Publication | 1 | View | |
| 2025-08-04 | A.PE |
Preliminary Amendment | — | View | |
| 2025-08-04 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2025-08-04 | A.PE |
Preliminary Amendment | 1 | View | |
| 2025-08-04 | SPEC |
Specification | 1 | View | |
| 2025-08-04 | REM |
Applicant Arguments/Remarks Made in an Amendment | 1 | View | |
| 2025-08-04 | DRW |
Drawings-only black and white line drawings | 6 | View | |
| 2025-08-04 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View | |
| 2025-08-04 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View | |
| 2025-08-04 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2025-07-10 | APP.FILE.REC |
Filing Receipt | 4 | View | |
| 2025-07-10 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2025-07-10 | M327 |
Miscellaneous Communication to Applicant - No Action Count | 1 | View | |
| 2025-07-10 | WELCOME.LET |
Welcome Letter from USPTO Director and Deputy Director | 1 | View | |
| 2025-06-26 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View | |
| 2025-06-26 | APP.TEXT |
Application body structured text document | — | View | |
| 2025-06-26 | ADS |
Application Data Sheet | 10 | View | |
| 2025-06-26 | SPEC |
Specification | 19 | View | |
| 2025-06-26 | CLM |
Claims | 4 | View | |
| 2025-06-26 | ABST |
Abstract | 1 | View | |
| 2025-06-26 | DRW |
Drawings-only black and white line drawings | 6 | View | |
| 2025-06-26 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2025-06-26 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2025-06-26 | M856 |
Letter Requesting Suspension of Action | 2 | View | |
| 2025-06-26 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View |
Inventors
Yee Kin Lum
Paya Terubong, MALAYSIA
Kah Hooi Lim
Bayan Lepas, MALAYSIA
Hon Khet Chuah
Bayan Lepas, MALAYSIA
Teik Wah Lim
Bayan Lepas, MALAYSIA
Jia Shern Fong
Kuala Terengganu, MALAYSIA
Wan Muhammad Haikal Sobri
Bandar Baru Bangi, MALAYSIA
Attorneys & Agents of Record
Classification
USPC
257/467
H10W40/00
H10W20/20
H10P74/23
H10W90/00
H10W90/297
H10W90/401
H10W90/724
H10W90/288
H10W72/227
H10W70/611
G01K7/01
G01K2217/00
H05K1/181
Prosecution
- Examiner
- CENTRAL, DOCKET
- Art Unit
- OPAP
- Customer No.
- 83515
- Docket No.
- AG4525-US|ALTR:0664
- Confirmation No.
- 2666
Publication
- Pub. No.
- US20250323111A1
- Pub. Date
- 2025-10-16
No related applications found.
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ALTERA CORPORATION
SECURITY INTEREST
Recorded 2025-09-12
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Quick Facts
- App. No.
- 19/251,058
- Filed
- 2025-06-26
- Pub. No.
- US20250323111A1
- Examiner
- CENTRAL, DOCKET
- Art Unit
- OPAP
External Links