EMBEDDED LIQUID COOLING
An integrated cooling assembly comprises a semiconductor device and a cold plate. A patterned side of the cold plate comprises a base surface, sidewalls, and support features. The base surface is spaced apart from the semiconductor device to collectively define a coolant channel therebetween. The sidewalls are bonded to the semiconductor device to define a perimeter of the coolant channel. The sidewalls slope away from the base surface to form an angle greater than 90 degrees therebetween. The support features are bonded to the semiconductor device inward of the perimeter. At least some of the support features are wider at the base surface than at a bonding interface with the semiconductor device. At least some of the support features are disposed between an inlet opening and an outlet opening of the cold plate.
1 . (canceled)
2 . An integrated cooling assembly comprising a semiconductor device and a cold plate bonded to the semiconductor device, the cold plate comprising a patterned first side and an opposite second side, wherein:
the patterned first side comprises a base surface, sidewalls, and a plurality of support features;
the base surface is spaced apart from the semiconductor device to collectively define a coolant channel therebetween;
the sidewalls are bonded to the semiconductor device to define a perimeter of the coolant channel;
the sidewalls slope away from the base surface to form an angle greater than 90 degrees therebetween;
the plurality of support features is bonded to the semiconductor device inward of the perimeter;
at least some of the plurality of support features are wider at the base surface than at a bonding interface with the semiconductor device;
the cold plate comprises an inlet opening and an outlet opening; and
at least some of the plurality of support features are disposed between the inlet opening and the outlet opening.
3 . The integrated cooling assembly of claim 2 , wherein a length of at least some of the support features of the plurality of support features is less than a length between the inlet opening and the outlet opening in a same direction.
4 . The integrated cooling assembly of claim 2 , wherein the inlet and outlet openings in the integrated cooling assembly comprise portions of a fluid path that further comprises the coolant channel.
5 . The integrated cooling assembly of claim 2 , wherein coolant fluid is circulated through the coolant channel through the inlet opening and the outlet opening.
6 . The integrated cooling assembly of claim 5 , wherein each support feature of the plurality of support features is configured to disrupt laminar fluid flow at an interface of the coolant fluid and a backside of the semiconductor device.
7 . The integrated cooling assembly of claim 2 , wherein the cold plate is bonded to the semiconductor device by direct dielectric bonds.
8 . The integrated cooling assembly of claim 2 , wherein the cold plate is bonded to the semiconductor device by direct hybrid bonds.
9 . The integrated cooling assembly of claim 2 , wherein the inlet and outlet openings in the cold plate extend between the patterned first side and the opposite second side of the cold plate.
10 . The integrated cooling assembly of claim 2 , wherein the inlet and outlet openings in the cold plate comprise gaps between the patterned first side of the cold plate and the semiconductor device.
11 . The integrated cooling assembly of claim 2 , wherein side surfaces of the cold plate and the semiconductor device are substantially flush with one another.
12 . The integrated cooling assembly of claim 2 , wherein:
the semiconductor device is a first semiconductor device;
the integrated cooling assembly further comprises a plurality of second semiconductor devices vertically arranged in a device stack; and
the device stack is attached to the patterned first side of the cold plate in a side-by-side arrangement with the first semiconductor device.
13 . The integrated cooling assembly of claim 12 , wherein the cold plate is attached to a second semiconductor device of the plurality of second semiconductor devices by direct dielectric bonds.
14 . The integrated cooling assembly of claim 12 , wherein the cold plate is attached to a second semiconductor device of the plurality of second semiconductor devices by direct hybrid bonds.
15 . The integrated cooling assembly of claim 2 , wherein the sloped sidewalls of the cold plate are formed by a wet etch.
16 . An integrated cooling assembly comprising a semiconductor device and a cold plate bonded to the semiconductor device, the cold plate comprising a patterned first side and an opposite second side, wherein:
the patterned first side comprises a base surface, sidewalls, and a plurality of support features;
the base surface is spaced apart from the semiconductor device to collectively define a coolant channel therebetween;
the sidewalls are bonded to the semiconductor device to define a perimeter of the coolant channel;
the sidewalls slope away from the base surface to form an angle greater than 90 degrees therebetween;
the plurality of support features is bonded to the semiconductor device inward of the perimeter;
at least some of the plurality of support features are wider at the base surface than at a bonding interface with the semiconductor device; and
the plurality of support features is configured to disrupt a laminar fluid flow at an interface of a coolant fluid and a backside of the semiconductor device.
17 . The integrated cooling assembly of claim 16 , wherein the cold plate is bonded to the semiconductor device by direct dielectric bonds.
18 . The integrated cooling assembly of claim 16 , wherein the cold plate is bonded to the semiconductor device by direct hybrid bonds.
19 . The integrated cooling assembly of claim 16 , wherein:
the semiconductor device is a first semiconductor device;
the integrated cooling assembly further comprises a plurality of second semiconductor devices vertically arranged in a device stack; and
the device stack is attached to the patterned first side of the cold plate in a side-by-side arrangement with the first semiconductor device.
20 . The integrated cooling assembly of claim 19 , wherein the cold plate is attached to a second semiconductor device of the plurality of second semiconductor devices by direct dielectric bonds.
21 . The integrated cooling assembly of claim 19 , wherein the cold plate is attached to a second semiconductor device of the plurality of second semiconductor devices by direct hybrid bonds.