PLANARIZED MEMBRANE AND METHODS FOR SUBSTRATE PROCESSING SYSTEMS
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in chemical mechanical planarization of a wafer. The method further includes finishing the surface of a wafer with the planarized membrane.
1 . A conditioning tool for planarizing a resilient membrane for a substrate carrier, the conditioning tool comprising:
a plate having a first surface configured to receive the resilient membrane, wherein moving contact between the first surface of the plate and the resilient membrane planarizes the resilient membrane;
an arm configured to press the resilient membrane against the first surface of the plate during planarization; and
one or more rollers configured to secure the resilient membrane to the arm during the planarization.
2 . The conditioning tool of claim 1 , wherein the first surface of the plate is sized to allow for two or more resilient membranes to be planarized simultaneously.
3 . The conditioning tool of claim 1 , wherein the arm is further configured to move linearly to provide force between the plate and the resilient membrane during the planarization.
4 . The conditioning tool of claim 1 , wherein the first surface of the plate comprises a polishing pad configured to provide planarization to the resilient membrane.
5 . The conditioning tool of claim 4 , wherein the polishing pad is treated to increase planarization of the resilient membrane.
6 . The conditioning tool of claim 1 , further comprising:
a fastener configured to secure the resilient membrane to the one or more rollers.
7 . The conditioning tool of claim 6 , wherein the fastener comprises: a magnet, a screw, and/or a bolt.
8 . The conditioning tool of claim 1 , wherein the one or more rollers configured to be positioned around an outer edge of the resilient membrane.
9 . The conditioning tool of claim 1 , further comprising:
a control mechanism located within a base of the conditioning tool and configured to actuate the arm.
10 . The conditioning tool of claim 9 , wherein the control mechanism comprises a plurality of gears that engage with the arm to cause the arm to move before or during the planarization.
11 . The conditioning tool of claim 9 , wherein the control mechanism is configured to:
receive information regarding a planar nature of the resilient membrane during the planarization; and
adjust a speed of the plate and/or a pressure applied by the arm based on the received information.
12 . The conditioning tool of claim 1 , further comprising:
a variable speed drive configured to adjust a rotating velocity of the plate during the planarization.
13 . A method for processing a resilient membrane for a substrate carrier, the method comprising:
providing the resilient membrane;
providing a membrane conditioning tool; and
applying the membrane conditioning tool to the resilient membrane to planarize a surface of the resilient membrane.
14 . The method of claim 13 , wherein the membrane conditioning tool comprises an abrasive material configured to be applied to the resilient membrane to planarize the surface of the resilient membrane.
15 . The method of claim 13 , further comprising:
planarizing the surface of the resilient membrane along with one or more additional resilient membranes simultaneously with the membrane conditioning tool in a single planarization cycle.
16 . The method of claim 13 , wherein:
the membrane conditioning tool comprises a plate, and
the planarizing of the surface of the resilient membrane comprises controlling a relative rotation velocity between the plate and the resilient membrane with respect to each other.
17 . The method of claim 13 , further comprising:
stretching the resilient membrane around a temporary membrane holder,
wherein planarizing the surface of the resilient membrane is performed while the resilient membrane is stretched.
18 . The method of claim 13 , further comprising:
providing a second resilient membrane; and
applying the membrane conditioning tool to the resilient membrane and the second resilient membrane simultaneously.
19 . The method of claim 13 , further comprising:
moving an arm of the membrane conditioning tool linearly to provide force between a plate of the membrane conditioning tool and the resilient membrane during planarization.
20 . The method of claim 13 , further comprising:
receiving information regarding a planar nature of the resilient membrane during planarization; and
adjusting a speed of a plate of the membrane conditioning tool and/or a pressure applied by an arm of the membrane conditioning tool based on the received information.