SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.
1 . A method, comprising:
providing a subpanel substrate on a subpanel base, the subpanel substrate comprising a dielectric structure and a conductive structure, wherein the subpanel substrate comprises a singulated portion of a panel substrate;
providing:
a first electronic component on a first side of the subpanel substrate and electrically coupled to a first portion of the conductive structure, and
a second electronic component on the first side of the subpanel substrate and electrically coupled to a second portion of the conductive structure;
removing the subpanel base;
providing:
a first external interconnect on a second side of the subpanel substrate and electrically coupled to the first portion of the conductive structure, and
a second external interconnect on the second side of the subpanel substrate and electrically coupled to the second portion of the conductive structure; and
singulating the subpanel substrate to provide individual unit substrates.
2 . A semiconductor device, comprising:
a unit substrate comprising a unit conductive structure and a unit dielectric structure; and
an electronic component coupled to the unit conductive structure;
wherein the unit substrate comprises a portion of a singulated subpanel substrate of a panel substrate.