ELECTRONIC ASSEMBLY, NOTABLY CONFIGURED TO BE INTEGRATED IN AN INVERTER
An electronic assembly includes a first cooling device having a first thermal contact face, a second cooling device having a second thermal contact face and a bearing face, at least one power electronics module, a retention structure having at least one elastic portion, and a plurality of attachment elements. The plurality of attachment elements exerts a force on the retention structure, giving rise to clamping loads on the bearing face of the second cooling device, these clamping loads being sufficient to rigidly secure together the first cooling device, the second cooling device and the retention structure.
1 . Electronic assembly comprising:
a first cooling device comprising a first thermal contact face,
a second cooling device comprising a second thermal contact face and a bearing face,
at least one power electronics module having a first face and a second face, in particular parallel to one another, the first face of the power electronics module being in thermal contact with the first thermal contact face of the first cooling device and the second face of the power electronics module being in thermal contact with the second thermal contact face of the second cooling device,
a retention structure placed in contact with the bearing face of the second cooling device, and comprising at least one elastic portion,
a plurality of attachment elements,
wherein:
the first cooling device and the elastic portion of the retention structure each comprise a plurality of attachment holes,
the plurality of attachment elements passes through the attachment holes and exerts a force on the retention structure, causing deformation of the elastic portions of the retention structure, this deformation giving rise to clamping loads on the bearing face of the second cooling device, these clamping loads being sufficient to rigidly secure together the first cooling device, the second cooling device and the retention structure.
2 . Electronic assembly according to claim 1 , wherein the retention structure comprises a plurality of wings forming elastic portions of the retention structure, and extending from the retention face of the retention structure on either side of the second cooling device, without being in contact with the second cooling device.
3 . Electronic assembly according to claim 1 , wherein the retention structure comprises a plurality of retention tabs comprising a flat portion forming part of the retention face of the retention structure, and a bent portion arranged to come into contact with a lateral face of the second cooling device in such a way as to hold the second cooling device in position laterally.
4 . Electronic assembly according to claim 1 , wherein the retention structure is made of metal, notably aluminium.
5 . Electronic assembly according to claim 1 , wherein the first cooling device comprises a first circulation channel for a heat transfer fluid and/or wherein the second cooling device comprises a second circulation channel for a heat transfer fluid.
6 . Electronic assembly according to claim 1 , wherein a thermal interface material is present between the first face of the power electronics module and the first thermal contact face of the first cooling device and/or between the second face of the electronic module and the second thermal contact face of the second cooling device.
7 . Electronic assembly according to claim 1 , wherein the electronic assembly comprises a positioning support arranged to receive the power electronics module or modules and to allow relative positioning between the power electronics module, the first cooling device and the second cooling device when the electronic assembly is being put together.
8 . Electronic assembly according to claim 1 , comprising a plurality of adjustment rings comprising:
a lower face placed in contact with a flat surface of the positioning support and/or of the first cooling device,
an upper face parallel to the retention structure, and placed facing an elastic area of the retention structure such that:
when the retention structure is placed, without deformation, in contact with the second cooling device, the upper face of the adjustment rings is located at a distance D from the retention structure,
when the retention structure is deformed by the force exerted by the attachment elements, the elastic parts of the retention structure are in contact with the upper face of the adjustment rings.
9 . Electronic assembly according to claim 8 , wherein the adjustment of the height of the adjustment rings makes it possible to adjust the vertical loads generated on the bearing face of the second cooling device by the retention structure.
10 . Inverter comprising an electronic assembly according to claim 1 .
11 . Electronic assembly according to claim 2 , wherein the retention structure comprises a plurality of retention tabs comprising a flat portion forming part of the retention face of the retention structure, and a bent portion arranged to come into contact with a lateral face of the second cooling device in such a way as to hold the second cooling device in position laterally.
12 . Electronic assembly according to claim 2 , wherein the retention structure is made of metal, notably aluminium.
13 . Electronic assembly according to claim 2 , wherein the first cooling device comprises a first circulation channel for a heat transfer fluid and/or wherein the second cooling device comprises a second circulation channel for a heat transfer fluid.
14 . Electronic assembly according to claim 2 , wherein a thermal interface material is present between the first face of the power electronics module and the first thermal contact face of the first cooling device and/or between the second face of the electronic module and the second thermal contact face of the second cooling device.
15 . Electronic assembly according to claim 2 , wherein the electronic assembly comprises a positioning support arranged to receive the power electronics module or modules and to allow relative positioning between the power electronics module, the first cooling device and the second cooling device when the electronic assembly is being put together.
16 . Electronic assembly according to claim 2 , comprising a plurality of adjustment rings comprising:
a lower face placed in contact with a flat surface of the positioning support and/or of the first cooling device,
an upper face parallel to the retention structure, and placed facing an elastic area of the retention structure such that:
when the retention structure is placed, without deformation, in contact with the second cooling device, the upper face of the adjustment rings is located at a distance D from the retention structure,
when the retention structure is deformed by the force exerted by the attachment elements, the elastic parts of the retention structure are in contact with the upper face of the adjustment rings.
17 . Inverter comprising an electronic assembly according to claim 2 .
18 . Electronic assembly according to claim 3 , wherein the retention structure is made of metal, notably aluminium.
19 . Electronic assembly according to claim 3 , wherein the first cooling device comprises a first circulation channel for a heat transfer fluid and/or wherein the second cooling device comprises a second circulation channel for a heat transfer fluid.
20 . Electronic assembly according to claim 3 , wherein a thermal interface material is present between the first face of the power electronics module and the first thermal contact face of the first cooling device and/or between the second face of the electronic module and the second thermal contact face of the second cooling device.