SEALED PACKAGE INCLUDING ELECTRONIC DEVICE AND POWER SOURCE
Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.
1 - 18 . (canceled)
19 . A hermetically-sealed package comprising:
a housing comprising an inner surface and an outer surface;
a substantially transparent substrate hermetically sealed to the housing, the substrate comprising:
a first major surface facing an interior of the housing; and
a second major surface opposite the first major surface;
an optical sensor disposed on the first major surface of the substrate within the housing; and
a power source disposed at least partially within the housing and electrically coupled to the optical sensor;
wherein the substrate is configured such that light from an external environment to the housing is transmitted through at least a portion of the substrate to the optical sensor.
20 . The package of claim 1 , wherein the optical sensor is configured to emit light through the substrate.
21 . The package of claim 20 , wherein the optical sensor is configured to receive reflected light through the substrate.
22 . The package of claim 19 , wherein the optical sensor comprises at least one of an infrared sensor or a near-infrared sensor.
23 . The package of claim 19 , wherein the substrate comprises a non-conductive material.
24 . The package of claim 19 , wherein the optical sensor is configured to detect a physiological parameter through the substrate.
25 . The package of claim 24 , wherein the physiological parameter comprises a blood oxygen level.
26 . The package of claim 19 , further comprising one or more electrodes disposed on the second major surface of the substrate.
27 . The package of claim 26 , further comprising a via extending between the first major surface and the second major surface, wherein the one or more electrodes are electrically connected to the optical sensor through the via.
28 . The package of claim 19 , wherein the substantially transparent substrate forms at least one entire wall of the package.
29 . A hermetically-sealed package comprising:
a housing defining a cavity;
a substantially transparent substrate hermetically sealed to the housing and comprising a first major surface and a second major surface;
an optical sensor disposed on the first major surface of the substrate within the cavity;
a power source disposed within the cavity, the power source comprising a power source contact; and
a device contact electrically coupled to the optical sensor;
wherein a non-bonded electrical connection is formed between the device contact and the power source contact when the substrate is hermetically sealed to the housing; and
wherein light emitted or detected by the optical sensor passes through at least a portion of the substrate.
30 . The package of claim 29 , wherein the power source contact comprises a resilient member configured to mechanically engage the device contact.
31 . The package of claim 29 , wherein the housing further comprises a flange surrounding the cavity, and wherein the substrate is hermetically sealed to the flange.
32 . The package of claim 29 , wherein the substrate is laser bonded to the housing.
33 . The package of claim 29 , wherein the substrate comprises a non-conductive material.
34 . The package of claim 29 , further comprising an antenna disposed on the second major surface of the substrate and electrically connected to the optical sensor.
35 . A method of forming a hermetically-sealed package comprising:
disposing a power source at least partially within a housing;
disposing an optical sensor on a first major surface of a substantially transparent substrate such that light from an environment adjacent a second major surface of the substrate is transmitted through at least a portion of the substrate and receivable by the optical sensor; and
hermetically sealing the substrate to the housing so that the optical sensor is disposed within the housing.
36 . The method of claim 35 , wherein the optical sensor is configured to emit light through the substrate.
37 . The method of claim 35 , wherein the optical sensor is configured to receive reflected light through the substrate.
38 . The method of claim 35 , wherein hermetically sealing the substrate to the housing comprises laser bonding the substrate to the housing.