IP Library › Granted Patent US 553,571
Granted Patent S1
US 553,571 · App. 29/200,217 · Granted Oct 23, 2007

Microcontroller enclosure housing

Assignee: Sauer-Danfoss Inc.
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Quick Facts
Patent No.
US 553,571
App. No.
29/200,217
Granted
Oct 23, 2007
Kind
S1
Claims (1)

The ornamental design for a microcontroller enclosure housing, as shown and described.

Assignments (3)
CHANGE OF NAME Recorded Nov 11, 2014
From: SAUER-DANFOSS INC.
To: DANFOSS POWER SOLUTIONS INC.
Reel/Frame 034205/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2004
From: CARPENTER, JOEL R.; PLUSKA, CAZARY
To: SAUER-DANFOSS INC.
Reel/Frame 015351/0270 →
PATENT ASSIGNMENT AND QUIT CLAIM DEED Recorded May 21, 2004
From: DESIGNFACTOR GBR
To: SAUER-DANFOSS INC.
Reel/Frame 015357/0067 →