IP Library › Granted Patent US 557,425
Granted Patent S1
US 557,425 · App. 29/236,933 · Granted Dec 11, 2007

Cover ring for a plasma processing apparatus

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Quick Facts
Patent No.
US 557,425
App. No.
29/236,933
Granted
Dec 11, 2007
Kind
S1
Claims (1)

We claim the ornamental design for cover ring for a plasma processing apparatus, as shown.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →