IP Library › Granted Patent US 557,226
Granted Patent S1
US 557,226 · App. 29/236,981 · Granted Dec 11, 2007

Electrode cover for a plasma processing apparatus

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Quick Facts
Patent No.
US 557,226
App. No.
29/236,981
Granted
Dec 11, 2007
Kind
S1
Claims (1)

The ornamental design for electrode cover for a plasma processing apparatus, as shown.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2005
From: UCHINO, TAKEO; SHICHIDA, HIROYUKI; ISOZAKI, MASAKAZU; TSUBONE, TSUNEHIKO; MAKINO, AKITAKA
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016925/0954 →