IP Library › Granted Patent US 546,354
Granted Patent S1
US 546,354 · App. 29/237,008 · Granted Jul 10, 2007

Semiconductor manufacturing apparatus

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Quick Facts
Patent No.
US 546,354
App. No.
29/237,008
Granted
Jul 10, 2007
Kind
S1
Claims (1)

The ornamental design for a semiconductor manufacturing apparatus, as shown.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2005
From: KIHARA, HIDEKI; SORAOKA, MINORU; OHIRABARU, YUZO; NGAYASU, NUBUO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016928/0065 →