IP Library › Granted Patent US 703,160
Granted Patent S1
US 703,160 · App. 29/397,274 · Granted Apr 22, 2014

Grounded electrode for a plasma processing apparatus

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Quick Facts
Patent No.
US 703,160
App. No.
29/397,274
Granted
Apr 22, 2014
Kind
S1
Claims (1)

I claim the ornamental design for a grounded electrode for a plasma processing apparatus, as shown.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →