IP Library › Granted Patent US 674,359
Granted Patent S1
US 674,359 · App. 29/417,102 · Granted Jan 15, 2013

LED package

Inventors: Chen-Hsiu Lin (New Taipei, TW); Yi-Chien Chang (Taipei, TW)
Assignees: Silitek Electronic (Guangzhou) Co., Ltd.; Lite-On Technology Corporation
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Quick Facts
Patent No.
US 674,359
App. No.
29/417,102
Granted
Jan 15, 2013
Kind
S1
Claims (1)

The ornamental design for a “LED package,” as shown and described.

Assignments (2)
CHANGE OF NAME Recorded Nov 5, 2013
From: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
To: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
Reel/Frame 031583/0291 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2012
From: LIN, CHEN-HSIU; CHANG, YI-CHIEN
To: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.; LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 027960/0829 →