IP Library › Granted Patent US 737,778
Granted Patent S1
US 737,778 · App. 29/479,418 · Granted Sep 1, 2015

Connectivity module

Inventors: Fabrizio Druscovich (Dolina, IT); Miran Locatelli (Dolina, IT); Cristian Vacchiano (Buia, IT); Antonino Sgroi (Duino Aurisina, IT); Bruno Vittori (Sagrado, IT); Sehoon Park (Seoul, KR)
Assignee: TELIT COMMUNICATIONS S.P.A.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 737,778
App. No.
29/479,418
Granted
Sep 1, 2015
Kind
S1
Claims (1)

The ornamental design for a connectivity module, as shown and described.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2019
From: HSBC BANK PLC
To: TELIT COMMUNICATIONS S.P.A.
Reel/Frame 048466/0354 →
SECURITY INTEREST Recorded Oct 13, 2016
From: TELIT COMMUNICATIONS S.P.A
To: HSBC BANK PLC
Reel/Frame 040007/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2014
From: DRUSCOVICH, FABRIZIO; LOCATELLI, MIRAN; VACCHIANO, CRISTIAN; SGROI, ANTONINO; VITTORI, BRUNO; PARK, SEHOON
To: TELIT COMMUNICATIONS S.P.A.
Reel/Frame 032117/0685 →