IP Library › Granted Patent US 753,604
Granted Patent S1
US 753,604 · App. 29/534,613 · Granted Apr 12, 2016

Connectivity module

Inventors: Fabrizio Druscovich (Trieste, IT); Miran Locatelli (Trieste, IT); Cristian Vacchiano (Udine, IT); Antonino Sgroi (Trieste, IT); Bruno Vittori (Gorizia, IT); Sehoon Park (Seoul, KR)
Assignee: TELIT COMMUNICATIONS S.P.A.
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Quick Facts
Patent No.
US 753,604
App. No.
29/534,613
Granted
Apr 12, 2016
Kind
S1
Claims (1)

The ornamental design for a connectivity module, as shown and described.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2019
From: HSBC BANK PLC
To: TELIT COMMUNICATIONS S.P.A.
Reel/Frame 048466/0354 →
SECURITY INTEREST Recorded Oct 13, 2016
From: TELIT COMMUNICATIONS S.P.A
To: HSBC BANK PLC
Reel/Frame 040007/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2016
From: DRUSCOVICH, FABRIZIO; LOCATELLI, MIRAN; VACCHIANO, CRISTIAN; SGROI, ANTONINO; VITTORI, BRUNO; PARK, SEHOON
To: TELIT COMMUNICATIONS S.P.A.
Reel/Frame 039466/0727 →
Continuity (1)
Division 29479418 · Jan 15, 2014