IP Library › Granted Patent US 802,790
Granted Patent S1
US 802,790 · App. 29/544,069 · Granted Nov 14, 2017

Cover ring for a plasma processing apparatus

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 802,790
App. No.
29/544,069
Granted
Nov 14, 2017
Kind
S1
Claims (1)

The ornamental design for a cover ring for a plasma processing apparatus, as shown and described.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2015
From: TAUCHI, SUSUMU; UEMURA, TAKASHI; SATO, KOHEI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 037382/0138 →