IP Library › Granted Patent US 793,618
Granted Patent S1
US 793,618 · App. 29/569,226 · Granted Aug 1, 2017

Mold for packaging semiconductor light emitting device

Inventors: Kyoung Min Kim (Gyeonggi-do, KR); Soo Kun Jeon (Gyeonggi-do, KR); Eun Hyun Park (Gyeonggi-do, KR)
Assignee: SEMICON LIGHT CO., LTD.
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Quick Facts
Patent No.
US 793,618
App. No.
29/569,226
Granted
Aug 1, 2017
Kind
S1
Claims (1)

The ornamental design for a mold for packaging semiconductor light emitting device, as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2023
From: SEMICON LIGHT CO., LTD.
To: LUMENS CO., LTD.
Reel/Frame 065788/0381 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2016
From: KIM, KYOUNG MIN; JEON, SOO KUN; PARK, EUN HYUN
To: SEMICON LIGHT CO., LTD.
Reel/Frame 039008/0444 →
Priority Claims (1)
KR 30-2015-0066133 · Dec 24, 2015 · national