IP Library › Granted Patent US 830,200
Granted Patent S1
US 830,200 · App. 29/582,157 · Granted Oct 9, 2018

Housing for packaging semiconductor light emitting device

Inventors: Kyoung Min Kim (Gyeonggi-do, KR); Gye Oul Jeong (Gyeonggi-do, KR)
Assignee: SEMICON LIGHT CO., LTD.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 830,200
App. No.
29/582,157
Granted
Oct 9, 2018
Kind
S1
Claims (1)

The ornamental design for a housing for packaging semiconductor light emitting device, as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2023
From: SEMICON LIGHT CO., LTD.
To: LUMENS CO., LTD.
Reel/Frame 065788/0381 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2016
From: KIM, KYOUNG MIN; JEONG, GYE OUL
To: SEMICON LIGHT CO., LTD.
Reel/Frame 040478/0753 →
Priority Claims (1)
KR 30-2016-0022110 · May 11, 2016 · national