IP Library › Granted Patent US 862,404
Granted Patent S1
US 862,404 · App. 29/601,165 · Granted Oct 8, 2019

Sealing material ring for a semiconductor manufacturing apparatus

Inventors: Satoru Murata (Toyama, JP); Shinya Morita (Toyama, JP); Masashi Suzuki (Yamatokoriyama, JP)
Assignees: KOKUSAI ELECTRIC CORPORATION; TOHO KASEI CO., LTD.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 862,404
App. No.
29/601,165
Granted
Oct 8, 2019
Kind
S1
Claims (1)

The ornamental design for a sealing material ring for a semiconductor manufacturing apparatus, as shown and described.

Assignments (3)
CHANGE OF NAME Recorded Mar 8, 2024
From: TOHO KASEI CO., LTD.
To: DAIKIN FINETECH, LTD.
Reel/Frame 066705/0170 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 046926/0886 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2017
From: MURATA, SATORU; MORITA, SHINYA; SUZUKI, MASASHI
To: HITACHI KOKUSAI ELECTRIC INC.; TOHO KASEI CO., LTD.
Reel/Frame 042068/0589 →
Priority Claims (1)
JP 2016-023182 · Oct 25, 2016 · national