IP Library Granted Patent US 840,364
Granted Patent S1
US 840,364 · App. 29/610,996 · Granted Feb 12, 2019

Electrode cover for a plasma processing apparatus

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Quick Facts
Patent No.
US 840,364
App. No.
29/610,996
Granted
Feb 12, 2019
Kind
S1
Claims (1)

The ornamental design for an electrode cover for a plasma processing apparatus, as shown and described.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2017
From: ICHINO, TAKAMASA; SATO, KOHEI; NAKAMOTO, KAZUNORI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 043532/0451 →