IP Library › Granted Patent US 859,470
Granted Patent S1
US 859,470 · App. 29/631,095 · Granted Sep 10, 2019

Interconnecting device for thermal management system

Inventors: Jianbin Shentu (Zhejiang, CN); Zhi Wu (Zhejiang, CN); Yaoyao Zhang (Zhejiang, CN); Long Lin (Zhejiang, CN)
Assignee: Hangzhou Sanhua Research Institute
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Quick Facts
Patent No.
US 859,470
App. No.
29/631,095
Granted
Sep 10, 2019
Kind
S1
Claims (1)

The ornamental design for an interconnecting device for thermal management system, as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2021
From: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.
To: ZHEJIANG SANHUA INTELLIGENT CONTROLS CO., LTD.
Reel/Frame 056100/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2019
From: SHENTU, JIANBIN; WU, ZHI; ZHANG, YAOYAO; LIN, LONG
To: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.
Reel/Frame 048544/0561 →
Priority Claims (1)
CN 2017 3 0280059 · Jun 29, 2017 · national