IP Library › Granted Patent US 1,064,811
Granted Patent S1
US 1,064,811 · App. 29/652,374 · Granted Mar 4, 2025

Package

Inventors: Hyunjun Yang (Seoul, KR); Yunhwan Kim (Seoul, KR); Deokhun Moon (Seoul, KR); Goeun Lee (Seoul, KR)
Assignee: SPIGEN KOREA CO., LTD.
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Quick Facts
Patent No.
US 1,064,811
App. No.
29/652,374
Granted
Mar 4, 2025
Kind
S1
Claims (1)

The ornamental design for a package, as shown and described.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2021
From: YANG, HYUNJUN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057207/0526 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2021
From: KIM, YUNHWAN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057207/0530 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2021
From: MOON, DEOKHUN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057208/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2021
From: LEE, GOEUN
To: SPIGEN KOREA CO., LTD.
Reel/Frame 057208/0584 →
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