Granted Patent
S1
US 893,484 · App. 29/673,181 · Granted Aug 18, 2020
Thermal control component
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Claims (1)
The ornamental design for a thermal control component, as shown and described.
Assignments (5)
RELEASE OF SECURITY INTEREST
Recorded Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →
RELEASE OF SECURITY INTEREST
Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
SUPPLEMENT NO. 12 TO PATENT SECURITY AGREEMENT
Recorded Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT
Recorded Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Dec 14, 2018
From: SCOBEE, DANIEL G.; SEMENUK, ALEKSANDR; THIRUVENGADAM, ASWIN
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047774/0524 →