IP Library › Granted Patent US 891,636
Granted Patent S1
US 891,636 · App. 29/688,724 · Granted Jul 28, 2020

Ring for a plasma processing apparatus

Inventors: Masakazu Isozaki (Tokyo, JP); Masahito Mori (Tokyo, JP); Kenetsu Yokogawa (Tokyo, JP); Takao Arase (Tokyo, JP); Taku Iwase (Tokyo, JP)
Assignee: Hitachi High-Tech Corporation
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Quick Facts
Patent No.
US 891,636
App. No.
29/688,724
Granted
Jul 28, 2020
Kind
S1
Claims (1)

The ornamental design for a ring for a plasma processing apparatus, as shown and described.

Assignments (2)
CHANGE OF NAME Recorded Apr 14, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052398/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2019
From: ISOZAKI, MASAKAZU; MORI, MASAHITO; YOKOGAWA, KENETSU; ARASE, TAKAO; IWASE, TAKU
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 049327/0779 →
Priority Claims (1)
JP 2018-023399 · Oct 25, 2018 · national