IP Library › Granted Patent US 926,715
Granted Patent S1
US 926,715 · App. 29/712,911 · Granted Aug 3, 2021

Support for a wafer for fabricating a semiconductor

Inventors: Akira Okabe (Nagasaki, JP); Yukio Takenaga (Nagasaki, JP)
Assignee: EPICREW CORPORATION
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 926,715
App. No.
29/712,911
Granted
Aug 3, 2021
Kind
S1
Claims (1)

The ornamental design for a support for a wafer for fabricating a semiconductor, as shown and described.

Assignments (2)
MERGER Recorded Jul 3, 2025
From: EPICREW CORPORATION
To: EPICREW CORPORATION
Reel/Frame 072207/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2019
From: OKABE, AKIRA; TAKENAGA, YUKIO
To: EPICREW CORPORATION
Reel/Frame 051047/0797 →
Priority Claims (1)
JP 2019-016842 · Jul 29, 2019 · national