Granted Patent
S1
US 1,003,043 · App. 29/821,324 · Granted Oct 31, 2023
Headset case
Assignee:
Shenzhen Earfun Technology Co., Ltd.
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Claims (1)
The ornamental design for a headset case, as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Dec 29, 2021
From: XU, HAO
To: SHENZHEN EARFUN TECHNOLOGY CO., LTD.
Reel/Frame 058499/0396 →
Priority Claims (1)
CN 202130653648.X
· Sep 30, 2021
· national