IP Library Granted Patent US 1,025,958
Granted Patent S1
US 1,025,958 · App. 29/821,511 · Granted May 7, 2024

Earphone

Inventors: Pohsun Lee (Shenzhen, CN); Laurent Lindenberger (Shenzhen, CN)
Assignee: Harman International Industries, Incorporated
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Quick Facts
Patent No.
US 1,025,958
App. No.
29/821,511
Granted
May 7, 2024
Kind
S1
Claims (1)

The ornamental design for an earphone, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2022
From: LEE, POHSUN; LINDENBERGER, LAURENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
Reel/Frame 059266/0199 →