IP Library › Granted Patent US 1,092,423
Granted Patent S1
US 1,092,423 · App. 29/839,251 · Granted Sep 9, 2025

Electrode plate for semiconductor manufacturing apparatus

Inventors: JaeHyun Kim (Hwaseong-si, KR); JeongHo Lee (Seoul, KR); HyunSoo Jang (Osan-si, KR)
Assignee: ASM IP Holding B.V.
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Quick Facts
Patent No.
US 1,092,423
App. No.
29/839,251
Granted
Sep 9, 2025
Kind
S1
Claims (1)

The ornamental design for an electrode plate for semiconductor manufacturing apparatus, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: KIM, JAEHYUN; LEE, JEONGHO; JANG, HYUNSOO
To: ASM IP HOLDING B.V.
Reel/Frame 060163/0869 →
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