Granted Patent
S1
US 1,098,056 · App. 29/866,426 · Granted Oct 14, 2025
Substrate processing apparatus
Assignee:
DAIKIN FINTECH, LTD.
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Claims (1)
The ornamental design for a substrate processing apparatus, as shown and described.
Assignments (2)
CHANGE OF NAME
Recorded Mar 8, 2024
From: TOHO KASEI CO., LTD.
To: DAIKIN FINETECH, LTD.
Reel/Frame 066705/0170 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Sep 12, 2022
From: DEGUCHI, YASUNORI
To: TOHO KASEI CO., LTD.
Reel/Frame 061061/0358 →
Priority Claims (1)
JP 2022-006811 D
· Mar 30, 2022
· national
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