IP Library › Granted Patent US 1,096,672
Granted Patent S1
US 1,096,672 · App. 29/871,215 · Granted Oct 7, 2025

Heat dissipation device

Inventors: Shaoming Huang (Beijing, CN); Hangkong Hu (Beijing, CN); Hongbo Zeng (Beijing, CN); Mingliang Hao (Beijing, CN); Shengqiang Xiao (Beijing, CN); Pengfei Zheng (Beijing, CN); Yurong Peng (Beijing, CN); Te Pi (Beijing, CN); Fengjie Li (Beijing, CN); Hongshan Zhu (Beijing, CN)
Assignee: BITMAIN TECHNOLOGIES INC.
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Quick Facts
Patent No.
US 1,096,672
App. No.
29/871,215
Granted
Oct 7, 2025
Kind
S1
Claims (1)

The ornamental design for a heat dissipation device as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2023
From: HUANG, SHAOMING; HU, HANGKONG; ZENG, HONGBO; HAO, MINGLIANG; XIAO, SHENGQIANG; ZHENG, PENGFEI; PENG, YURONG; PI, TE; LI, FENGJIE; ZHU, HONGSHAN
To: BITMAIN TECHNOLOGIES INC.
Reel/Frame 062759/0963 →
Priority Claims (1)
CN 202230535722.2 · Aug 16, 2022 · national
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