IP Library › Granted Patent US 1,003,278
Granted Patent S1
US 1,003,278 · App. 29/875,031 · Granted Oct 31, 2023

Combined headset and case

Inventor: Hongping Huang (Shenzhen, CN)
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Quick Facts
Patent No.
US 1,003,278
App. No.
29/875,031
Granted
Oct 31, 2023
Kind
S1
Claims (1)

The ornamental design for a combined headset and case, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2023
From: HUANG, HONGPING
To: SHENZHEN QIAO COMMUNICATION TECHNOLOGY CO., LTD
Reel/Frame 063472/0240 →