IP Library › Granted Patent US 1,123,649
Granted Patent S1
US 1,123,649 · App. 29/979,891 · Granted Apr 28, 2026

Sensor assembly

Inventors: Jinseok Hwang (Mountain View, CA); Brett Kurpiewski (Mountain View, CA); Toshihiro Fujimura (San Francisco, CA); Jared Gross (Belmont, CA); Zhaokun Wang (Mountain View, CA); Chun Chen (Castro Valley, CA)
Assignee: Waymo LLC
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Quick Facts
Patent No.
US 1,123,649
App. No.
29/979,891
Granted
Apr 28, 2026
Kind
S1
Claims (1)

The ornamental design for a sensor assembly as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2026
From: HWANG, JINSEOK; KURPIEWSKI, BRETT; FUJIMURA, TOSHIHIRO; GROSS, JARED; WANG, ZHAOKUN; CHEN, CHUN
To: WAYMO LLC
Reel/Frame 073853/0560 →
References Cited (39)
US D750513S · King et al. · 2016 [cited by applicant]
US D796975S · Jou · 2017 [cited by examiner]
US D858381S · Ahn et al. · 2019 [cited by applicant]
US D882426S · Gross · 2020 [cited by examiner]
US D885213S · Dreyer · 2020 [cited by examiner]
US D891953S · Kuvelker et al. · 2020 [cited by applicant]
US D947689S · Gross · 2022 [cited by examiner]
US D947690S · Gross · 2022 [cited by examiner]
US D953176S · Chen et al. · 2022 [cited by applicant]
US D964249S · Ahn et al. · 2022 [cited by applicant]
US D964908S · Ahn et al. · 2022 [cited by applicant]
US D964909S · Ahn et al. · 2022 [cited by applicant]
US D965498S · Ahn · 2022 [cited by examiner]
US 11493922B1 · Avram et al. · 2022 [cited by applicant]
US 11557127B2 · Toth et al. · 2023 [cited by applicant]
US D978058S · Ahn · 2023 [cited by examiner]
US D986084S · Jones et al. · 2023 [cited by applicant]
US D1001654S · Ahn et al. · 2023 [cited by applicant]
US D1008055S · Ahn · 2023 [cited by examiner]
US D1016636S · Ahn et al. · 2024 [cited by applicant]
US D1100793S · Ahn · 2025 [cited by examiner]
US 20220144185A1 · Burnette et al. · 2022 [cited by applicant]
CN 306494595 · 2021 [cited by applicant]
CN 307359823 · 2022 [cited by applicant]
CN 217227440U · 2022 [cited by applicant]
JP 2005047504A · 2005 [cited by applicant]
JP 3817780B2 · 2006 [cited by applicant]
JP D1671877 · 2020 [cited by applicant]
JP D1671878 · 2020 [cited by applicant]
JP D1691300 · 2022 [cited by applicant]
JP D1691301 · 2022 [cited by applicant]
JP D1691302 · 2022 [cited by applicant]
JP D1691989 · 2022 [cited by applicant]
JP D1692040 · 2022 [cited by applicant]
JP D1692041 · 2022 [cited by applicant]
JP D1697322 · 2022 [cited by applicant]
JP D1697704 · 2022 [cited by applicant]
WO 2015105252A1 · 2015 [cited by applicant]
WO 2023144663A1 · 2023 [cited by applicant]