IP Library Granted Patent US 1,106,124
Granted Patent S1
US 1,106,124 · App. 30/008,499 · Granted Dec 16, 2025

Microphone mount

Inventors: Yi-Shun Chen (Hsinchu, TW); Jimmy Huynh (Fountain Valley, CA)
Assignee: Hewlett-Packard Development Company, L.P.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 1,106,124
App. No.
30/008,499
Granted
Dec 16, 2025
Kind
S1
Claims (1)

The ornamental design for a microphone mount, as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2025
From: CHEN, YI-SHUN; HUYNH, JIMMY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 072289/0455 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2025
From: CHEN, YI-SHUN; HUYNH, JIMMY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 071424/0324 →
Continuity (1)
Continuation 29913246 · Sep 28, 2023
References Cited (57)
US 3592422A · Norman · 1971 [cited by applicant]
US 3924083A · Hagey · 1975 [cited by applicant]
US 4194096A · Ramsey · 1980 [cited by applicant]
US 4396807A · Brewer · 1983 [cited by applicant]
US D305026S · Wolf · 1989 [cited by applicant]
US 6459802B1 · Young · 2002 [cited by applicant]
US 6682043B1 · Hsieh · 2004 [cited by applicant]
US 7040831B2 · Rapaport · 2006 [cited by applicant]
US D540786S · Hensen · 2007 [cited by applicant]
US 8571250B2 · Royer · 2013 [cited by examiner]
US D705761S · Mcgovern et al. · 2014 [cited by applicant]
US D706245S · Mcgovern et al. · 2014 [cited by applicant]
US D707662S · Okita · 2014 [cited by applicant]
US 8783636B2 · Okita · 2014 [cited by applicant]
US 8783638B2 · Dantas et al. · 2014 [cited by applicant]
US D737254S · Mun et al. · 2015 [cited by applicant]
US 9843852B2 · Mcgovern et al. · 2017 [cited by applicant]
US D823283S · Sunwoo et al. · 2018 [cited by applicant]
US D830160S · Kogon · 2018 [cited by examiner]
US D834568S · Pooley · 2018 [cited by applicant]
US D850423S · Chen · 2019 [cited by applicant]
US D868754S · Chou · 2019 [cited by examiner]
US 10575078B2 · Slaton · 2020 [cited by applicant]
US D885877S · Magagna · 2020 [cited by examiner]
US D889443S · Renwick · 2020 [cited by applicant]
US D901459S · Zhao · 2020 [cited by applicant]
US D910604S · Zheng · 2021 [cited by applicant]
US D929973S · Mai · 2021 [cited by applicant]
US D933640S · Zhou · 2021 [cited by applicant]
US D948485S · Mai · 2022 [cited by applicant]
US D954687S · Mai · 2022 [cited by applicant]
US D958119S · Mai · 2022 [cited by applicant]
US D969117S · Li · 2022 [cited by applicant]
US D971191S · Mai · 2022 [cited by applicant]
US D1029811S · Suzuki · 2024 [cited by examiner]
US D1043627S · Suzuki et al. · 2024 [cited by applicant]
US D1045837S · Trewartha · 2024 [cited by examiner]
US D1083885S · Chen · 2025 [cited by examiner]
US 20060227991A1 · Klemme · 2006 [cited by applicant]
US 20070195983A1 · Klemme · 2007 [cited by applicant]
US 20100239113A1 · Browne · 2010 [cited by applicant]
US 20110168867A1 · Hennessey · 2011 [cited by examiner]
US 20130004010A1 · Royer · 2013 [cited by examiner]
US 20130062479A1 · Okita · 2013 [cited by applicant]
US 20130270414A1 · Mcgovern et al. · 2013 [cited by applicant]
US 20140270311A1 · Parker et al. · 2014 [cited by applicant]
US 20160119701A1 · Ikeda · 2016 [cited by applicant]
CN 304583775S · 2018 [cited by applicant]
CN 306196947S · 2020 [cited by applicant]
CN 306832297S · 2021 [cited by applicant]
CN 306956309S · 2021 [cited by applicant]
CN 307035190S · 2021 [cited by applicant]
CN 309050738 · 2025 [cited by examiner]
CN 309131010 · 2025 [cited by examiner]
CN 309456017 · 2025 [cited by examiner]
GB 9003821396001 · 2017 [cited by examiner]
JP D1807238 · 2025 [cited by examiner]