Granted Patent
S1
US 1,107,684 · App. 30/009,451 · Granted Dec 30, 2025
Headphone
Inventors:
Lei Zhong (Shenzhen, CN); Sunjie Huang (Shenzhen, CN); Zeteng Yan (Shenzhen, CN); Haochen Liu (Shenzhen, CN); Shuailin Xie (Shenzhen, CN)
Assignee:
SHENZHEN SHOKZ CO., LTD.
View Patent ↗
Loading inventors, assignments & file history…
Claims (1)
The ornamental design for a headphone as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Aug 25, 2025
From: ZHONG, LEI; HUANG, SUNJIE; YAN, ZETENG; LIU, HAOCHEN; XIE, SHUAILIN
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 072103/0811 →
Priority Claims (2)
CN 202330228921.3
· Apr 23, 2023
· national
CN 202330514251.1
· Aug 11, 2023
· national
Continuity (1)
Division
35522477
· Sep 22, 2023
References Cited (79)
US 8411893B2
· Ito
· 2013
[cited by examiner]
US 8433082B2
· Abolfathi
· 2013
[cited by applicant]
US D740785S
· Chen
· 2015
[cited by examiner]
US 9788097B2
· Bullen
· 2017
[cited by examiner]
US D906281S
· Zhang et al.
· 2020
[cited by applicant]
US D907002S
· Zhang et al.
· 2021
[cited by applicant]
US D909996S
· Zhang et al.
· 2021
[cited by applicant]
US D915345S
· Zhang et al.
· 2021
[cited by applicant]
US D926726S
· Zhang et al.
· 2021
[cited by applicant]
US D953291S
· Mao
· 2022
[cited by examiner]
US D955364S
· Wu
· 2022
[cited by examiner]
US D995468S
· Zhang
· 2023
[cited by examiner]
US D996391S
· Zhang
· 2023
[cited by examiner]
US 20240276137A1
· Zhang
· 2024
[cited by examiner]
US 20240284090A1
· Zhang
· 2024
[cited by examiner]
US 20240305919A1
· Zhang
· 2024
[cited by examiner]
US 20240430611A1
· Li
· 2024
[cited by examiner]
US 20250024191A1
· Li
· 2025
[cited by examiner]
US 20250088783A1
· Huang
· 2025
[cited by examiner]
US 20250097622A1
· Deng
· 2025
[cited by examiner]
US 20250119678A1
· Li et al.
· 2025
[cited by applicant]
US 20250126398A1
· Zhang
· 2025
[cited by examiner]
US 20250126402A1
· Fu et al.
· 2025
[cited by applicant]
US 20250168554A1
· Tong
· 2025
[cited by examiner]
US 20250203269A1
· Xie
· 2025
[cited by examiner]
US 20250227405A1
· Turpin
· 2025
[cited by examiner]
US 20250254461A1
· Zhu
· 2025
[cited by examiner]
JP D1663637S
· 2020
[cited by applicant]
JP D1663638S
· 2020
[cited by applicant]
JP D1663716S
· 2020
[cited by applicant]
JP D1788428S
· 2025
[cited by applicant]
JP D1788429S
· 2025
[cited by applicant]
JP D1788430S
· 2025
[cited by applicant]
JP D1788431S
· 2025
[cited by applicant]
JP D1788432S
· 2025
[cited by applicant]
JP D1788433S
· 2025
[cited by applicant]
JP D1788434S
· 2025
[cited by applicant]
JP D1788435S
· 2025
[cited by applicant]
JP D1788436S
· 2025
[cited by applicant]
WO D247388001
· 2025
[cited by examiner]