IP Library › Granted Patent US 1,013,495
Granted Patent S1
US 1,013,495 · App. 35/514,288 · Granted Feb 6, 2024

Structural material connection bracket

Inventor: Yasuo Ishida (Shizuoka, JP)
Assignee: SUS CO., LTD.
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Quick Facts
Patent No.
US 1,013,495
App. No.
35/514,288
Granted
Feb 6, 2024
Kind
S1
Claims (1)

The ornamental design for a structural material connection bracket, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2022
From: ISHIDA, YASUO
To: SUS CO., LTD.
Reel/Frame 060622/0648 →
Priority Claims (1)
JP 2021-010941 · May 25, 2021 · national