Patent Application
Provisional
App. No. 60/275,670
· Confirmation No. 3979
Method for global die thinning and polishing of flip-chip packaged integrated circuits
Provisional Application Expired
Inventors
Chung C. Tsao
Cupertino, CA
John Valliant
Santa Cruz, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 24251
- Docket No.
- M-9720 US
- Confirmation No.
- 3979
Child
Claims priority from a provisional application
→
App. 10/693,310
· US 6,939,209
Filed 2003-10-24
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Child
Claims priority from a provisional application
→
App. 09/924,736
· US 6,672,947
Filed 2001-08-07
· Patented Case
Child
PCT
is a Continuation of
→
PCT/US2002/007305
Filed 2002-03-11
· RO PROCESSING COMPLETED-PLACED IN STORAGE
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/275,670
- Filed
- 2001-03-13
External Links