IP Library › Patent Application 60281497
Patent Application Provisional
App. No. 60/281,497 · Confirmation No. 2347

Wafer fabrication for thermal pole tip expansion/recession compensation

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2001-04-04 TRNA Transmittal of New Application 3 View
2001-04-04 SPEC Specification 1 View
2001-04-04 DRW Drawings-only black and white line drawings 2 View
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Quick Facts
App. No.
60/281,497
Filed
2001-04-04